M95M01-RMN6P STMicroelectronics, M95M01-RMN6P Datasheet - Page 37

• Manufacturer Part Number: M95M01-RMN6P
• Description: IC EEPROM 1MBIT 5MHZ 8SOIC
• Manufacturer: STMicroelectronics

Specifications of M95M01-RMN6P

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1M (128K x 8)
• Speed: 5MHz
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Density: 1Mb
• Interface Type: Serial (SPI)
• Organization: 128Kx8
• Access Time (max): 80ns
• Frequency (max): 5MHz
• Write Protection: Yes
• Data Retention: 40Year
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: SOIC N
• Operating Temp Range: -40C to 85C
• Supply Current: 5mA
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8616-5; M95M01-RMN6P

M95M01-R, M95M01-W
Figure 21. WLCSP – 8 bump wafer length chip scale package
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
3. Bump position designation as per JESD 95-1, SPP-010.
Table 18.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
b
D
E
e
e1
e2
F
G
N (number of bumps)
aaa
bbb
ccc
ddd
eee
Symbol
WLCSP – 8 bump wafer length chip scale package
Bump
Wafer back side
D
0.580
0.230
0.350
0.322
3.570
2.050
0.600
2.400
1.200
0.585
0.425
0.110
0.110
0.110
0.060
0.060
Note
Øddd M
b(8x)
Øccc M
Typ
(3)
Orientation reference
Z X Y
Z
Detail A rotated by 90°
E
Doc ID 13264 Rev 7
millimeters
0.555
Min
A1
A2
Seating plane
Side view
0.605
3.685
2.165
A
Max
(2)
Detail A
Orientation
reference
8
0.0228
0.0091
0.0138
0.0127
0.1406
0.0807
0.0236
0.0945
0.0472
0.0230
0.0167
0.0043
0.0043
0.0043
0.0024
0.0024
Typ
Package mechanical data
Bump side
e1
0.0219
inches
e2
F
Min
(1)
e
G
ai16079
e2
0.0238
0.1451
0.0852
Max
37/41