MX884HTTR IXYS, MX884HTTR Datasheet - Page 6

• Manufacturer Part Number: MX884HTTR
• Description: IC CURRENT MONITOR TSOT23-6
• Manufacturer: IXYS

Specifications of MX884HTTR

• Function: Current Monitor
• Sensing Method: High-Side
• Voltage - Input: 3 ~ 60 V
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-6, TSOT-6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Operating Temperature: -
• Accuracy: -

3.3 Mechanical Dimensions
6
3.3.1 TSOT23-6 Package
3.3.2 Tape & Reel Dimensions
Embossed Carrier
NOTES:
1. 10 sprocket hole pitch cumulative tolerance ±0.2
2. Camber not to exceed 1mm in 100mm
3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole
4. (S.R. Ohm/Sq.) means surface electric resistivity of the carrier tape.
(0.030 / 0.035)
Notes: (Unless otherwise specified)
1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm
2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.
3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body
0.75 / 0.90
(0.004 inches) per side.
excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.
(0.102 / 0.118)
2.60 / 3.00
(0.000 / 0.004)
0.00 / 0.10
(0.028 / 0.031)
0.70 / 0.80
(7.01 DIA.)
178 DIA.
Top Cover
Tape Thickness
0.066 MAX.
(0.003 MAX.)
6
1
(0.110 / 0.118)
(0.095 BSC)
2.80 / 3.00
1.90 BSC
(0.014 / 0.020)
0.35 / 0.51
Embossment
5º NOM
(0.037 BSC)
0.95 BSC
(0.059 / 0.067)
1.50 / 1.70
7º NOM
K
(0.126 ± 0.004)
(0.077 MAX.)
B
0
=1.956 MAX.
O
=3.2 ± 0.1
www.clare.com
(0.059 ± 0.004)
(0.004 MIN)
0.10 MIN
ø1.5 ± 0.1
(0.0236 REF)
(0.0098 BSC)
0.60 REF
0.25 BSC
(0.157 ± 0.004)
P=4.0 ± 0.1
0º / 8º
(0.015 MIN)
(0.004 / 0.010)
0.37 MIN
0.10 / 0.25
Recommended PCB Land Pattern
(0.126 ± 0.004)
A
O
=3.2 ± 0.1
(0.079 ± 0.002)
(0.157 ± 0.004)
2.0 ± 0.05
P=4.0 ± 0.1
(0.037)
(0.106)
0.95
2.70
(inches MIN / inches MAX)
(0.069 ± 0.004)
(0.043 ± 0.004)
mm MIN / mm MAX
ø1.1 ± 0.1
1.75 ± 0.1
Dimensions
(0.138 ± 0.002)
3.5 ± 0.05
(0.041)
1.05
(0.024)
(0.315 ± 0.008)
0.60
W=8.0 ± 0.2
12/20/2006
Dimensions
MX884
(inches)
mm