NIS5135MN1TXG ON Semiconductor, NIS5135MN1TXG Datasheet - Page 11

• Manufacturer Part Number: NIS5135MN1TXG
• Description: IC ELECTRONIC FUSE 10DFN
• Manufacturer: ON Semiconductor

Specifications of NIS5135MN1TXG

• Function: Electronic Fuse
• Voltage - Input: 3.1 ~ 18 V
• Current - Output: 3.6A
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Polarity: Positive
• Input Voltage Max: 6.65 V
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Linear Misc Type: Positive Voltage
• Package Type: DFN EP
• Operating Supply Voltage (min): 3.1V
• Operating Supply Voltage (max): 18V
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Product Depth (mm): 3mm
• Product Length (mm): 3mm
• Mounting: Surface Mount
• Pin Count: 10
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Accuracy: -
• Sensing Method: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
10X
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
PIN 1
L
0.15 C
A B
NOTE 3
10X
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
TOP VIEW
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
C
0.5651
10X
SEATING
PLANE
MOLD CMPD
http://onsemi.com
DFN10, 3x3, 0.5P
L1
2.1746
CASE 485C−01
0.3008
ISSUE B
A1
Bottom View
10X
(Optional)
DETAIL A
SOLDERING FOOTPRINT*
11
É É É
É É É
É É É
Side View
(Optional)
DETAIL B
EDGE OF PACKAGE
2.6016
EXPOSED Cu
DIMENSIONS: MILLIMETERS
A3
0.5000 PITCH
1.8508
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
D
K
b
E
e
L
MILLIMETERS
3.3048
MIN
0.80
0.00
0.18
2.40
1.70
0.35
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
MAX
1.00
0.05
0.30
2.60
1.90
0.45
0.03
NIS5135/D