PCF2112CT/1,118 NXP Semiconductors, PCF2112CT/1,118 Datasheet - Page 2

• Manufacturer Part Number: PCF2112CT/1,118
• Description: IC LCD DRIVER 32SEG 40-VSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF2112CT/1,118

• Package / Case: 40-VSOP
• Display Type: LCD
• Configuration: 32 Segment
• Interface: Serial
• Current - Supply: 20µA
• Voltage - Supply: 2.25 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Segments: 32
• Operating Supply Voltage: 2.25 V to 6 V
• Maximum Power Dissipation: 500 mW
• Maximum Operating Temperature: + 85 C
• Maximum Supply Current: 50 uA
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Package Type: VSO
• Pin Count: 40
• Mounting: Surface Mount
• Power Dissipation: 500mW
• Operating Supply Voltage (min): 2.25V
• Operating Supply Voltage (max): 6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-1066-2; 935279199118; PCF2112CTD-T

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
6.1
6.2
6.3
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
9
10
11
12
13
13.1
13.1.1
13.1.2
13.2
13.2.1
13.2.2
13.2.3
14
15
1997 Mar 28
LCD drivers
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAMS
PINNING
PCF2100C
PCF2111C
PCF2112C
FUNCTIONAL DESCRIPTION
PCF2100C
PCF2111C
PCF2112C
Bus control logic
Timing
Input circuitry
Expansion
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
AC CHARACTERISTICS
PACKAGE OUTLINES
SOLDERING
Plastic dual in-line packages
By dip or wave
Repairing soldered joints
Plastic small outline packages
By wave
By solder paste reflow
Repairing soldered joints (by hand-held
soldering iron or pulse-heated solder tool)
DEFINITIONS
LIFE SUPPORT APPLICATIONS
2
PCF21xxC family
Product specification