PCF8576CT/1,112 NXP Semiconductors, PCF8576CT/1,112 Datasheet - Page 2

• Manufacturer Part Number: PCF8576CT/1,112
• Description: IC LCD DVR UNVRSL LOW-MUX 56VSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8576CT/1,112

• Package / Case: 56-VSOP
• Display Type: LCD
• Configuration: 40 Segment
• Interface: I²C
• Current - Supply: 120µA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 20
• Number Of Segments: 160
• Maximum Clock Frequency: 315 KHz
• Operating Supply Voltage: 2 V to 6 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Attached Touch Screen: No
• Maximum Supply Current: 120 uA
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935278818112; PCF8576CTD; PCF8576CTD

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
6.1
6.2
6.3
6.4
6.5
6.5.1
6.5.2
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
6.15
6.16
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
2001 Oct 02
Universal LCD driver for low multiplex rates
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Power-on reset
LCD bias generator
LCD voltage selector
LCD drive mode waveforms
Oscillator
Internal clock
External clock
Timing
Display latch
Shift register
Segment outputs
Backplane outputs
Display RAM
Data pointer
Subaddress counter
Output bank selector
Input bank selector
Blinker
CHARACTERISTICS OF THE I
Bit transfer (see Fig.12)
START and STOP conditions (see Fig.13)
System configuration (see Fig.14)
Acknowledge (see Fig.15)
PCF8576 I
Input filters
I
Command decoder
Display controller
Cascaded operation
2
C-bus protocol
2
C-bus controller
2
C-BUS
2
8
9
10
11
11.1
11.2
12
12.1
13
14
15
16
17
17.1
17.2
17.3
17.4
17.5
18
19
20
21
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
AC CHARACTERISTICS
Typical supply current characteristics
Typical characteristics of LCD outputs
APPLICATION INFORMATION
Chip-on-glass cascadability in single plane
BONDING PAD INFORMATION
TRAY INFORMATION: PCF8576U
TRAY INFORMATION: PCF8576U/2
PACKAGE OUTLINES
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
Product specification
2
C COMPONENTS
PCF8576