ISL33001IRTZ-T Intersil, ISL33001IRTZ-T Datasheet - Page 14

• Manufacturer Part Number: ISL33001IRTZ-T
• Description: IC BUS BUFF HOTSWAP 2WR 8TDFN
• Manufacturer: Intersil
• Type: I²C-Bus and SMBus Switchr

Specifications of ISL33001IRTZ-T

• Applications: General Purpose, Buffer/Bus Extender
• Internal Switch(s): Yes
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-WDFN Exposed Pad
• For Use With: ISL33001MSOPEVAL1Z - EVAL BOARD ISL33001 8MSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Typical Performance Curves
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD
POTENTIAL (POWERED UP):
PROCESS:
GND
0.25µm CMOS
FIGURE 23. SDA/SCL PIN CAPACITANCE vs TEMPERATURE vs V
14
ISL33001, ISL33002, ISL33003
12
11
10
9
8
7
6
-30
V
CC
-10
= 2.3V
C
Specified. (Continued)
IN
TEMPERATURE (°C)
= C
10
V
CC
OUT
= 3.3V
= 10pF, V
30
V
50
CC
CC1
= 5.5V
= V
70
CC2
= V
90
CC
, T
A
= +25°C; Unless Otherwise
CC
September 30, 2010
FN7560.2