ISL33001IRTZ-T Intersil, ISL33001IRTZ-T Datasheet - Page 2

• Manufacturer Part Number: ISL33001IRTZ-T
• Description: IC BUS BUFF HOTSWAP 2WR 8TDFN
• Manufacturer: Intersil
• Type: I²C-Bus and SMBus Switchr

Specifications of ISL33001IRTZ-T

• Applications: General Purpose, Buffer/Bus Extender
• Internal Switch(s): Yes
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-WDFN Exposed Pad
• For Use With: ISL33001MSOPEVAL1Z - EVAL BOARD ISL33001 8MSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
NOTES:
Pin Configurations
ISL33001IRTZ
ISL33001IRT2Z
ISL33001IBZ
ISL33001IUZ
ISL33002IRTZ
ISL33002IRT2Z
ISL33002IUZ
ISL33003IRTZ
ISL33003IRT2Z
ISL33003IUZ
ISL33001MSOPEVAL1Z
ISL33002MSOPEVAL1Z
ISL33003MSOPEVAL1Z
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
2. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
information on MSL please see techbrief TB363.
PART NUMBER
(Notes 1, 2, 3)
SCL_OUT
SCL_IN
GND 4
EN
1
2
3
(8 LD TDFN)
ISL33001
TOP VIEW
3001
01R2
33001 IBZ
33001
3002
02R2
33002
3003
03R2
33003
ISL33001 Evaluation Board
ISL33002 Evaluation Board
ISL33003 Evaluation Board
PAD
2
MARKING
PART
ISL33001, ISL33002, ISL33003
8
7
6
5
SDA_OUT
V
SDA_IN
READY
CC1
TEMP. RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
(°C)
SCL_OUT
SCL_IN
8 Ld TDFN (0.5mm Pitch)
8 Ld SOIC
8 Ld MSOP
8 Ld TDFN (0.5mm Pitch)
8 Ld MSOP
8 Ld TDFN (0.5mm Pitch)
8 Ld MSOP
8 Ld TDFN (0.65mm Pitch)
8 Ld TDFN (0.65mm Pitch)
8 Ld TDFN (0.65mm Pitch)
GND
EN
ISL33001, ISL33002,
1
2
3
4
PACKAGE
(Pb-free)
(8 LD SOIC, MSOP)
ISL33001
TOP VIEW
ISL33003. For more
L8.3x3A
L8.3x3H
M8.15
M8.118
L8.3x3A
L8.3x3H
M8.118
L8.3x3A
L8.3x3H
M8.118
8
7
6
5
September 30, 2010
V
SDA_OUT
SDA_IN
READY
CC1
DWG. #
PKG.
FN7560.2