L6206N STMicroelectronics, L6206N Datasheet - Page 3
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L6206N
Manufacturer Part Number
L6206N
Description
IC DRVR FULL BRDG DUAL 24PWRDIP
Manufacturer
STMicroelectronics
Type
H Bridger
Datasheet
1.L6206N.pdf
(23 pages)
Specifications of L6206N
Input Type
Non-Inverting
Number Of Outputs
4
On-state Resistance
300 mOhm
Current - Output / Channel
2.8A
Current - Peak Output
5.6A
Voltage - Supply
8 V ~ 52 V
Operating Temperature
-25°C ~ 125°C
Mounting Type
Through Hole
Package / Case
24-DIP (0.300", 7.62mm)
Operating Temperature Classification
Automotive
Package Type
PDIP
Operating Supply Voltage (min)
8V
Operating Supply Voltage (typ)
48V
Operating Supply Voltage (max)
52V
Operating Supply Voltage
8 V to 52 V
Supply Current
0.01 A
Mounting Style
Through Hole
Motor Type
Full Bridge
No. Of Outputs
4
Output Current
2.8A
Supply Voltage Range
8V To 52V
Driver Case Style
DIP
No. Of Pins
24
Operating Temperature Range
-40°C To +150°C
Svhc
No SVHC
Rohs Compliant
Yes
For Use With
497-4135 - EVAL BOARD FOR L6206 SERIES
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
497-4211-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
L6206N
Manufacturer:
ST
Quantity:
20 000
THERMAL DATA
(1)
(2)
(3)
(4)
PIN CONNECTIONS (Top View)
(5) The slug is internally connected to pins 1,18,19 and 36 (GND pins).
R
R
R
R
R
Symbol
R
th-j-amb1
th-j-amb1
th-j-amb1
th-j-amb2
th-j-case
th-j-pins
Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm
Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm
Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm
and a ground layer.
Mounted on a multi-layer FR4 PCB without any heat sinking surface on the board.
SENSE
SENSE
OUT1
OUT1
OCD
OCD
GND
GND
IN1
IN2
IN1
IN2
A
A
A
A
A
B
B
B
B
B
MaximumThermal Resistance Junction-Pins
Maximum Thermal Resistance Junction-Case
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
PowerDIP24/SO24
1
2
3
4
5
6
7
8
9
10
11
12
D99IN1089A
24
23
22
21
20
19
18
17
16
15
14
13
Description
PROGCL
EN
VCP
OUT2
VS
GND
GND
VS
OUT2
VBOOT
EN
PROGCL
A
A
B
B
A
B
A
B
PROGCL
SENSE
OUT2
OUT1
OCD
1
3
GND
GND
2
4
N.C.
N.C.
N.C.
VCP
IN1
IN2
N.C.
N.C.
N.C.
EN
VS
A
A
A
A
A
A
A
A
A
PowerDIP24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
18
43
58
-
-
-
PowerSO36
D99IN1090A
2
SO24
2
(with a thickness of 35 µm), 16 via holes
(with a thickness of 35 µm).
14
51
77
-
-
-
2
(with a thickness of 35 µm).
(5)
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
PowerSO36
GND
N.C.
N.C.
VS
OUT2
N.C.
VBOOT
EN
PROGCL
IN2
IN1
SENSE
OCD
N.C.
OUT1
N.C.
N.C.
GND
35
15
62
1
-
-
B
B
B
B
B
B
B
B
B
L6206
Unit
C/W
C/W
C/W
C/W
C/W
C/W
3/23