VND810 STMicroelectronics, VND810 Datasheet
VND810
Specifications of VND810
Available stocks
Related parts for VND810
VND810 Summary of contents
Page 1
... December 2008 Double channel high-side driver V CC (1) 36V Description The VND810 is a double channel high-side driver designed Technology. The VND810 is intended for driving any type of multiple load with one side connected to ground. The Active V (a) device against low energy spikes (see ISO7637 transient compatibility table) ...
Page 2
... Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 SO-16 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 ECOPACK 5.2 SO-16 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Solution 1: a resistor in the ground line (RGND only Solution 2: a diode ( the ground line . . . . . . . . . . . . . . . . . . . . 17 GND ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 = 13.5V VND810 ...
Page 3
... VND810 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data (per island Table 5. Power output Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 CC Table 8. Switching (V = 13V 25° Table 9. Logic inputs Table 10. ...
Page 4
... Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 20 Figure 29. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 30. Thermal fitting model of a quad channel HSD in SO- Figure 31. SO-16 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 32. SO-16 tube shipment (no suffix Figure 33. SO-16 tape and reel shipment (suffix “TR” 4/ CASE VND810 ...
Page 5
... VND810 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE CLAMP UNDERVOLTAGE CLAMP 1 DRIVER 1 CURRENT LIMITER 1 ...
Page 6
... Power dissipation (per island tot T Junction operating temperature j T Case operating temperature c T Storage temperature stg 6/27 Parameter = 0Ω 13.5V 150º bat jstart = 25°C lead VND810 Value Unit 41 - 0.3 - 200 mA Internally limited - 6 +/- 10 mA +/- 10 mA 4000 4000 5000 5000 5A) L 8.3 ...
Page 7
... VND810 2.2 Thermal data Table 4. Thermal data (per island) Symbol R Thermal resistance junction-lead thj-lead Thermal resistance junction-ambient R thj-amb (one chip ON) 1. When mounted on a standard single-sided FR-4 board with 0.5cm to all V pins. Horizontal mounting and no artificial air flow When mounted on a standard single-sided FR-4 board with 4cm all V pins ...
Page 8
... 1A 6mH OUT Min. Typ. Max. Unit 5 5.5 36 160 320 5V -75 = 13V; = 13V; Min. Typ. Max. 150 175 200 135 7 15 > TSD = 13V 3.5 5 7.5 < 36V 7 VND810 mΩ mΩ 40 µA 25 µ µA 0 µA 5 µA 3 µA Unit °C °C °C µ ...
Page 9
... VND810 Table Symbol V Forward on voltage F Table 8. Switching (V Symbol t Turn-on delay time d(on) t Turn-off delay time d(off) dV /dt Turn-on voltage slope OUT (on) dV /dt Turn-off voltage slope OUT (off) Table 9. Logic inputs Symbol V Input low level IL I Low level input current IL V Input high level ...
Page 10
... V OUT OL OUT OL t DOL(on) 80% /dt OUT (on) 10 90% t DSENSE t d(on) Test conditions Min. Typ. Max OUT 1.5 2.5 IN OVER TEMP STATUS TIMING T > TSD V INn V STATn t SDL 90% dV /dt OUT (off d(off) t VND810 Unit 80 mA 200 µs 3.5 V 1000 µs t SDL ...
Page 11
... VND810 Table 12. Truth table Conditions Normal operation Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < I Table 13. Electrical transient requirements ISO T/R 7637/1 Test pulse 26.5V 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device ...
Page 12
... INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS n INPUT n LOAD VOLTAGE STATUS INPUT n LOAD CURRENT STATUS n 12/27 NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN LOAD with external pull- OPEN LOAD without external pull-up n OVERTEMPERATURE T TSD > V OUT OL VND810 ...
Page 13
... VND810 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) (uA) 2.5 2.25 Off state 2 Vcc= 36V Vin= Vout= 0V 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -50 - (°C ) Figure 9. Input clamp voltage Vicl (V) 8 7.8 I in= 1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6 ...
Page 14
... Tc= 25°C 125 100 Tc= - 40° Vcc (V) Vhyst (V) 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 -50 - 100 125 150 Tc (°C ) Vil (V) 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 -50 - 100 125 150 Tc (°C ) VND810 CC 40 175 175 ...
Page 15
... VND810 Figure 19. Status leakage current Ilstat (uA) 0.05 0.04 Vstat= 5V 0.03 0.02 0.01 0 -50 - (°C ) Figure 21. Status clamp voltage Vscl (V) 8 7.8 I stat= 1mA 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50 - (°C ) Figure 23. Open load off-state voltage detection threshold Vol (V) 5 4.5 ...
Page 16
... I maximum on-state currents of the different devices. 16/27 +5V +5V STATUS1 INPUT1 STATUS2 INPUT2 V GND GND ) S(on)max ) / ( - GND (when V < 0 during reverse battery situations) is: GND GND V CC OUTPUT1 OUTPUT2 GND R GND D GND only) GND resistor: becomes the sum of the S(on)max VND810 D ld ...
Page 17
... VND810 Please note that, if the microprocessor ground is not shared by the device ground, then the R will produce a shift (I GND values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same R If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below ...
Page 18
... Olmin + R ))R < Olmin. PU out V batt DRI VER INP UT + LOGI TATUS ROUND ) connected between PU ) like the +5V line used to supply the has to be higher than OUT < OLmax L(off2) is pulled high (up to several mA), the pull L(off2) OUT R L VND810 OUT ...
Page 19
... VND810 3.5 Maximum demagnetization energy (V Figure 26. Maximum turn-off current versus load inductance 0 single pulse repetitive pulse repetitive pulse Note: Values are generated with R In case of repetitive pulses, T must not exceed the temperature specified above for curves B and C. 1 L(mH) = 150ºC Jstart = 100º ...
Page 20
... Figure 27. SO-16 PC board Note: Layout condition of R thickness = 1.6mm, Cu thickness = 35µm, Copper areas: 0.26 cm Figure 28. R thj-amb RTH j-amb (° 20/27 and Z measurements (PCB FR4 area = 58mm x 58mm, PCB PCB copper area in open box free air condition PCB Cu heats ink area (cm 4cm ). VND810 ...
Page 21
... VND810 Figure 29. Thermal impedance junction ambient single pulse ZTH (°C/ W) 1000 100 10 1 0.1 0.01 0.0001 0.001 Equation 1 pulse calculation formula : ⋅ δ THδ TH δ ⁄ where p Figure 30. Thermal fitting model of a quad channel HSD in SO-16 Tj_1 Pd1 Tj_2 0.01 0.1 ...
Page 22
... Package and PCB thermal data Table 14. Thermal parameters Area / island (cm 22/ (°C/W) R2 (°C/W) R3 (°C/W) R4 (°C/W) R5 (°C/W) R6 (°C/W) C1 (W.s/°C) C2 (W.s/°C) C3 (W.s/°C) C4 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) VND810 Footprint 6 0.35 1.8 4 0.0001 7E-04 6E-03 0.2 0 ...
Page 23
... VND810 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 31. SO-16 package dimensions ...
Page 24
... Package and packing information Table 15. SO-16 mechanical data DIM 24/27 mm. Min. Typ. 0.1 0.35 0.19 0.5 45° (typ.) 9.8 5.8 1.27 8.89 3.8 4.6 0.5 8° (max.) VND810 Max. 1.75 0.2 1.65 0.46 0.25 10 6.2 4.0 5.3 1.27 0.62 ...
Page 25
... VND810 5.2 SO-16 packing information Figure 32. SO-16 tube shipment (no suffix) Figure 33. SO-16 tape and reel shipment (suffix “TR”) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter ...
Page 26
... Cu condition insertion in thermal data table (page 3 output diode section update (page 4). CC Protections note insertion (page 4). Revision history table insertion (page 18). Disclaimers update (page 19). Document reformatted and restructured. 3 Added contents, list of tables and figures. ® Added ECOPACK packages VND810 Changes information. ...
Page 27
... VND810 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...