VND830SP-E STMicroelectronics, VND830SP-E Datasheet - Page 16

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VND830SP-E

Manufacturer Part Number
VND830SP-E
Description
IC DRIVER HIGH SIDE 2CH PWRSO10
Manufacturer
STMicroelectronics
Type
High Sider
Datasheets

Specifications of VND830SP-E

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
60 mOhm
Current - Peak Output
9A
Voltage - Supply
5.5 V ~ 36 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
PowerSO-10 Exposed Bottom Pad
Supply Voltage (min)
5.5 V
Supply Current
0.012 mA
Maximum Power Dissipation
73500 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Device Type
High Side
Module Configuration
High Side
Peak Output Current
9A
Output Resistance
0.06ohm
Input Delay
30µs
Output Delay
30µs
Supply Voltage Range
5.5V To 36V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output / Channel
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VND830SP-E
Manufacturer:
IR
Quantity:
3 351
Part Number:
VND830SP-E
Manufacturer:
ST
0
VND830SP-E
Figure 30. PowerSO-10 Thermal Impedance Junction Ambient Single Pulse
Figure 31. Thermal fitting model of a double
channel HSD in PowerSO-10
16/20
1000
Tj_1
Tj_2
0.01
100
Pd1
0.1
10
0.0001
ZTH (°C/W)
1
Pd2
C1
R1
C1
R1
C2
R2
C2
R2
0.001
C3
R3
T_amb
C4
R4
0.01
C5
R5
0.1
C6
R6
Time (s)
Pulse calculation formula
Table 14. Thermal Parameter
Z
1
where
R1 (°C/W)
R2 (°C/W)
R3( °C/W)
R4 (°C/W)
R5 (°C/W)
R6 (°C/W)
C1 (W.s/°C)
C2 (W.s/°C)
C3 (W.s/°C)
C4 (W.s/°C)
C5 (W.s/°C)
C6 (W.s/°C)
TH
Area/island (cm
=
R
10
TH
=
t
p
+
T
2
Z
)
100
THtp
1 –
Footprint
5.00E-03
0.001
0.05
0.02
0.75
1000
0.3
0.3
0.8
0.3
12
37
3
Footprint
6 cm
22
6
5
2

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