VND830SP-E STMicroelectronics, VND830SP-E Datasheet - Page 21

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VND830SP-E

Manufacturer Part Number
VND830SP-E
Description
IC DRIVER HIGH SIDE 2CH PWRSO10
Manufacturer
STMicroelectronics
Type
High Sider
Datasheets

Specifications of VND830SP-E

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
60 mOhm
Current - Peak Output
9A
Voltage - Supply
5.5 V ~ 36 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
PowerSO-10 Exposed Bottom Pad
Supply Voltage (min)
5.5 V
Supply Current
0.012 mA
Maximum Power Dissipation
73500 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Device Type
High Side
Module Configuration
High Side
Peak Output Current
9A
Output Resistance
0.06ohm
Input Delay
30µs
Output Delay
30µs
Supply Voltage Range
5.5V To 36V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output / Channel
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VND830SP-E
Manufacturer:
IR
Quantity:
3 351
Part Number:
VND830SP-E
Manufacturer:
ST
0
VND830SP-E
4
4.1
Note:
Package and PCB thermal data
PowerSO-10 thermal data
Figure 27. PowerSO-10 PC board
Layout condition of R
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to
8 cm
Figure 28. R
2
).
thj-amb
th
vs PCB copper area in open box free air condition
and Z
th
Doc ID 10879 Rev 2
measurements (PCB FR4 area = 58 mm x 58 mm, PCB
Package and PCB thermal data
21/28

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