BUK139-50DL,118 NXP Semiconductors, BUK139-50DL,118 Datasheet
BUK139-50DL,118
Specifications of BUK139-50DL,118
BUK139-50DL /T3
BUK139-50DL /T3
Related parts for BUK139-50DL,118
BUK139-50DL,118 Summary of contents
Page 1
... Total power dissipation D T Continuous junction temperature j R Drain-source on-state resistance DS(ON) I Input supply current ISL FUNCTIONAL BLOCK DIAGRAM INPUT LOGIC AND PROTECTION Fig.1. Elements of the TOPFET. PIN CONFIGURATION tab Product specification BUK139-50DL MAX. UNIT 150 ˚ 650 IS DRAIN CLAMP POWER MOSFET RIG ...
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... Human body model 250 pF 1.5 k CONDITIONS ˚ ˚ 250 Hz mb REQUIRED CONDITION 5 CONDITIONS - minimum footprint FR4 PCB the over temperature trip operates to protect the switch. j(TO) 2 Product specification BUK139-50DL MIN. MAX ˚C - self - limited 125 ˚ - -55 175 - 150 - 260 MIN. MAX. ...
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... A; t 300 300 4 CONDITIONS V;T = 25˚ device trips if P > D(TO) which determines trip time according to the formula ln DSC . IS 3 Product specification BUK139-50DL MIN. TYP. MAX 0. 100 = 25 ˚ ˚ 100 = 25 ˚ MIN. TYP. MAX. = 25˚ 120 160 1 200 350 600 150 ...
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... CONDITIONS normal operation; protection latched; 1 reset time t 100 < IS1 IS2 Refer to waveform figure and test circuit. L CONDITIONS Product specification BUK139-50DL MIN. TYP. MAX. 0 25˚C 1.1 1.6 2 100 220 400 195 330 200 400 650 130 ...
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... REFERENCES JEDEC EIAJ 1 , centre pin connected to mounting base. 5 Product specification BUK139-50DL SOT428 max. max. min. 0.7 10.4 2.95 0.5 0.2 0.2 0.5 9.6 2.55 ...
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... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 6 Product specification BUK139-50DL Rev 2.000 ...