IXDR502D1B IXYS, IXDR502D1B Datasheet - Page 5
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IXDR502D1B
Manufacturer Part Number
IXDR502D1B
Description
IC GATE LS DRVR SGL 2A 6-DFN
Manufacturer
IXYS
Type
Low Sider
Datasheet
1.IXDR502D1B.pdf
(11 pages)
Specifications of IXDR502D1B
Input Type
Inverting
Number Of Outputs
1
On-state Resistance
4 Ohm
Current - Output / Channel
500mA
Current - Peak Output
2A
Voltage - Supply
4.5 V ~ 25 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
6-DFN
Rise Time
12 ns
Fall Time
10 ns
Supply Voltage (min)
4.5 V
Supply Current
2 mA
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Number Of Drivers
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Pin Description
Pin Configuration
Figure 3 - Characteristics Test Diagram
CAUTION: Follow proper ESD procedures when handling and assembling this component.
IXYS reserves the right to change limits, test conditions, and dimensions.
PIN NUMBER
4,5,6
1
2
3
GND
GND
GND
5
6
4
IXDS 6 Lead DFN (D1B)
10uF
SYMBOL
(Bottom View)
GND
OUT
Vcc
IN
Vcc
NOTE: Solder tabs on bottoms of DFN packages are grounded
Supply Voltage
0.01uF
Drive Output
Signal Input
FUNCTION
1
2
3
Ground
OUT
Vcc
IN
Input signal-TTL or CMOS compatible.
Positive power supply voltage input. This pin provides power to the
entire chip. The range for this voltage is from 4.5V to 25V.
Driver output. For application purposes, this pin is connected via a
resistor to the gate of a MOSFET or IGBT.
The drivers ground pins. Internally connected to all circuitry, these
pins provide ground reference for the entire device. These pins
should be connected to a low noise analog ground plane for
optimum performance.
1000 pF
Agilent 1147A
Current Probe
1
3
2
5
GND
GND
GND
IN
OUT
Vcc
5
4
6
IXDR 6 Lead DFN (D1B)
GND
GND
GND
(Bottom View)
DESCRIPTION
IXDR502 / IXDS502
6
5
4
1
2
3
OUT
Vcc
IN