TDA3681ATH/N1C,512 NXP Semiconductors, TDA3681ATH/N1C,512 Datasheet - Page 20

• Manufacturer Part Number: TDA3681ATH/N1C,512
• Description: IC VOLT REG W/SW & IGNIT 20-HSOP
• Manufacturer: NXP Semiconductors

Specifications of TDA3681ATH/N1C,512

• Applications: Ignition Buffer, Regulator
• Current - Supply: 110µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935285812512; TDA3681ATH/N1C; TDA3681ATH/N1C

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
8. Hot bar or manual soldering is suitable for PMFP packages.
2003 Aug 29
BGA, LBGA, LFBGA, SQFP, SSOP-T
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP
Multiple voltage regulator with
switch and ignition buffer
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(5)
(8)
, SO, SOJ
10 C measured in the atmosphere of the reflow oven. The package body peak temperature
PACKAGE
(3)
(1)
, TFBGA, VFBGA
20
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
WAVE
(4)
SOLDERING METHOD
(5)(6)
(7)
suitable
suitable
suitable
suitable
suitable
not suitable
Product specification
TDA3681A
REFLOW
(2)