LM75BGD,125 NXP Semiconductors, LM75BGD,125 Datasheet - Page 25

• Manufacturer Part Number: LM75BGD,125
• Description: IC TEMP SENSOR DGTL 8-UXSON
• Manufacturer: NXP Semiconductors

Specifications of LM75BGD,125

• Package / Case: 8-XSON
• Function: Temp Sensor, Watchdog
• Topology: ADC (Sigma Delta), Comparator, Oscillator, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -55°C ~ 125°C
• Output Type: I²C™
• Output Alarm: No
• Output Fan: Yes
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Temperature Threshold: + 80 C
• Full Temp Accuracy: +/- 3 C
• Digital Output - Bus Interface: I2C
• Digital Output - Number Of Bits: 11
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.8 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Supply Current: 100 uA
• Temperature Sensor Function: Temp Sensor
• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4769-2; 935288239125

NXP Semiconductors
LM75B_2
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 19.
Table 20.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
20
Rev. 02 — 9 December 2008
23.
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
Digital temperature sensor and thermal watchdog
3
3
)
)
Figure
350 to 2000
260
250
245
23) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
LM75B
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