MCZ34702EWR2 Freescale Semiconductor, MCZ34702EWR2 Datasheet - Page 6
![IC PWR SUPPLY 3A SW 32-SOIC](/photos/39/29/392938/soic32-w_sml.jpg)
MCZ34702EWR2
Manufacturer Part Number
MCZ34702EWR2
Description
IC PWR SUPPLY 3A SW 32-SOIC
Manufacturer
Freescale Semiconductor
Datasheet
1.MC34702EK.pdf
(39 pages)
Specifications of MCZ34702EWR2
Applications
Controller, Power QUICC™ I, II
Voltage - Input
2.8 ~ 6 V
Number Of Outputs
2
Voltage - Output
7.75V, 0.8 ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-SOIC (7.5mm Width)
Output Current
3 A
Input Voltage
2.8 V to 6 V
Switching Frequency
300 KHz
Mounting Style
SMD/SMT
Duty Cycle (max)
95 %
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 2.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
6
34702
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Notes
Storage Temperature
Peak Package Reflow Temperature During Reflow
Maximum Junction Temperature
Thermal Resistance
Thermal Resistance, Junction to Base
Operational Package Temperature (Ambient Temperature)
2.
3.
4.
5.
6.
Junction to Ambient (Single Layer)
Junction to Ambient (Four Layers)
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics..
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.
Per JEDEC JESD51-6 with the board horizontal
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
Maximum Ratings (continued)
Rating
(4)
(4)
(6)
,
,
(5)
(5)
(2)
,
(3)
Symbol
T
T
T
R
R
JMAX
PPRT
STG
T
θJA
θJB
A
Analog Integrated Circuit Device Data
-65 to 150
-40 to 85
Value
Note 3
125
70
55
18
Freescale Semiconductor
°C/W
°C/W
Unit
°C
°C
°C
°C