BD9703FP-E2 Rohm Semiconductor, BD9703FP-E2 Datasheet - Page 13
![IC REG SW W/MOSFET 1CH TO252-5](/photos/7/37/73740/dpak_sc-63_to-252_to252-5_pkg_sml.jpg)
BD9703FP-E2
Manufacturer Part Number
BD9703FP-E2
Description
IC REG SW W/MOSFET 1CH TO252-5
Manufacturer
Rohm Semiconductor
Type
Step-Down (Buck)r
Datasheet
1.BD9703FP-E2.pdf
(17 pages)
Specifications of BD9703FP-E2
Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
1 ~ 32 V
Current - Output
1.5A
Frequency - Switching
300kHz
Voltage - Input
8 ~ 36 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (4 leads + tab)
Power - Output
800mW
Primary Input Voltage
35V
No. Of Outputs
1
Output Voltage
32V
Output Current
1.5A
Voltage Regulator Case Style
TO-252
No. Of Pins
5
Operating Temperature Range
-40°C To +85°C
Svhc
No SVHC (18-Jun-2010)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
BD9703FP-E2TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BD9703FP-E2
Manufacturer:
ROHM
Quantity:
1 250
Company:
Part Number:
BD9703FP-E2
Manufacturer:
ROHM
Quantity:
7 082
Part Number:
BD9703FP-E2
Manufacturer:
ROHM/罗姆
Quantity:
20 000
© 2009 ROHM Co., Ltd. All rights reserved.
BD9701FP/CP-V5/T/T-V5,BD9703FP/CP-V5/T/T-V5,BD9702CP-V5/T/T-V5
www.rohm.com
8. IC pin input
9. Common impedance
10. Pin short and mistake fitting
(PinA)
N
This IC is a monolithic IC which (as below) has P+ substrate and betweenthe various pin. A P-N junction is formed from
this P layer of each pin. For example the relation between each potential is as follows. (When GND > PinB and GND >
PinA, the P-N junction operates as a parasitic diode.) Parasitic diodes can occur inevitably in the structure of the IC. The
operation of parasitic diodes can result in mutual interference among circuits as well as operation faults and physical
damage. Accordingly, you must not use methods by which parasitic diodes operate, such as applying a voltage that is
lower than the GND(P substrate)voltage to an input pin.
Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple
as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and
capacitance).
Do not short-circuit between OUT pin and VCC pin, OUT pin and GND pin,
or VCC pin and GND pin. When soldering the IC on circuit board,
please be unusually cautious about theorientation and the position of the IC.
Parasitic diode
P
+
(PinA)
GND
Resistance
P substrate
N
Parasitic diode
GND
P
Fig.34 Simplified structure of a Bipolar IC
Back current prevention diode
P
+
Other adjacent components
Bypass diode
N
VCC
(PinB)
Parasitic diode
Fig.35
13/16
N
Output Pin
P
+
(PinB)
C
Transistor (NPN)
B
B
N
N
P substrate
GND
P
E
C
GND
Parasitic diode
E
P
+
N
Technical Note
2009.04- Rev.B
GND