PIP202-12M-2,518 NXP Semiconductors, PIP202-12M-2,518 Datasheet - Page 20

• Manufacturer Part Number: PIP202-12M-2,518
• Description: IC DC-DC CONV 68-HVQFN
• Manufacturer: NXP Semiconductors
• Type: Step-Down (Buck)r

Specifications of PIP202-12M-2,518

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 5 V
• Current - Output: 25A
• Frequency - Switching: 1MHz
• Voltage - Input: 3.3 ~ 12 V
• Operating Temperature: -55°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Power - Output: 25W
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2327-2; 934057818518; PIP202-12M-2 /T3

Philips Semiconductors
Contents
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2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
8
9
10
11
11.1
11.2
11.3
11.4
11.5
12
13
14
15
15.1
15.2
16
16.1
16.2
17
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20
© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 24 November 2003
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 9
Test information . . . . . . . . . . . . . . . . . . . . . . . . 13
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Basic functionality . . . . . . . . . . . . . . . . . . . . . . . 3
MOSFET driver function . . . . . . . . . . . . . . . . . . 4
Bootstrap diode. . . . . . . . . . . . . . . . . . . . . . . . . 4
3-state function . . . . . . . . . . . . . . . . . . . . . . . . . 5
Typical application. . . . . . . . . . . . . . . . . . . . . . . 9
Advantages of an integrated driver . . . . . . . . . 10
External connection of power and signal lines 10
Switching frequency . . . . . . . . . . . . . . . . . . . . 11
Thermal design. . . . . . . . . . . . . . . . . . . . . . . . 11
Introduction to soldering MLF packages. . . . . 15
Rework guidelines . . . . . . . . . . . . . . . . . . . . . 16
PCB design guidelines . . . . . . . . . . . . . . . . . . 16
Solder paste printing. . . . . . . . . . . . . . . . . . . . 17
Document order number: 9397 750 11943
DC-to-DC converter powertrain
PIP202-12M-2