MAX15037ATE+T Maxim Integrated Products, MAX15037ATE+T Datasheet - Page 21

• Manufacturer Part Number: MAX15037ATE+T
• Description: IC DC/DC CONV 3A 16-TQFN-EP
• Manufacturer: Maxim Integrated Products
• Type: Step-Down (Buck)r

Specifications of MAX15037ATE+T

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.6 ~ 23 V
• Current - Output: 3A
• Frequency - Switching: 200kHz ~ 2.2MHz
• Voltage - Input: 4.5 ~ 23 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-TQFN Exposed Pad
• Power - Output: 2.67W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2) Isolate the power components and high-current
3) Keep the high-current paths short, especially at the
4) Connect SGND and PGND together close to the
5) Keep the power traces and load connections short.
6) Ensure that the feedback connection from FB to
7) Route high-speed switching nodes (BST/VDD,
side of the PCB. Do not make a direct connection of
the exposed pad copper plane to the SGND (pin 10)
underneath the IC. Connect this plane and SGND
together at the return terminal of the V+ bypass
capacitor
paths from sensitive analog circuitry.
ground terminals. This practice is essential for sta-
ble, jitter-free operation.
return terminals of the V
bypass capacitors near the IC. Do not connect them
together anywhere else.
This practice is essential for high efficiency. Use
thick copper PCBs to enhance full-load efficiency
and power dissipation capability.
C
SOURCE) away from the sensitive analog areas
(BYPASS, COMP, FB, and OSC). Use internal PCB
layers for SGND as EMI shields to keep radiated
noise away from the IC, feedback dividers, and the
analog bypass capacitors.
OUT
is short and direct.
______________________________________________________________________________________
2.2MHz, 3A Buck or Boost Converters
with an Integrated High-Side Switch
L
and V+ high-frequency
1) Place the power components (inductor, C
2) Group the gate-drive components (boost diodes
3) Make the ground connections as follows:
C
other. Make all these connections on the top layer
with wide, copper-filled areas (2oz copper recom-
mended).
and capacitors, and V
near the controller IC.
a) Create a small-signal ground plane underneath
b) Connect this plane to SGND and use this plane
c) Connect SGND and PGND together at the
OUT
the IC.
for the ground connection for BYPASS, COMP,
FB, and OSC.
return terminal of V+ and V
near the IC. Make this the only connection
between SGND and PGND.
) first, with ground terminals close to each
L
bypass capacitor) together
Layout Procedure
L
bypass capacitors
IN
, and
21