CS51413EDR8G ON Semiconductor, CS51413EDR8G Datasheet - Page 20

• Manufacturer Part Number: CS51413EDR8G
• Description: IC REG BUCK LV 1.5A SYNC 8SOIC
• Manufacturer: ON Semiconductor
• Type: Step-Down (Buck)r

Specifications of CS51413EDR8G

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Current - Output: 1.5A
• Frequency - Switching: 520kHz
• Voltage - Input: 4.5 ~ 40 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Mounting Style: SMD/SMT
• Primary Input Voltage: 40V
• No. Of Outputs: 1
• Output Current: 1.5A
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +85°C
• Current Rating: 1.5A
• Filter Terminals: SMD
• Input Voltage Primary Max: 40V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: CS51413EDR8GOS

PUBLICATION ORDERING INFORMATION
V
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ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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is a trademark of Switch Power, Inc.
18X
PIN 1 LOCATION
2X
0.08
0.10
2X
18X
18X
0.15
0.15
C
C
L
K
C
PACKAGE THERMAL DATA
R
C
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
qJA
BOTTOM VIEW
1
18
SIDE VIEW
TOP VIEW
e
D2
D
10
A1
Parameter
9
(A3)
18X
E2
E
A
b
0.10
0.05 C
B
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
A
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SEATING
PLANE
C
C
http://onsemi.com
DFN18 6x5, 0.5P
NOTE 3
A
CASE 505−01
B
ISSUE D
Typical
20
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
4.19
1
DFN18
SOLDERING FOOTPRINT
35
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
D
E
K
L
b
e
3.24
5.30
MILLIMETERS
MIN
0.80
0.00
0.18
3.98
2.98
0.20
0.45
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.20 REF
6.00 BSC
5.00 BSC
0.50 BSC
MAX
1.00
0.05
0.30
4.28
3.28
0.65
°C/W
−−−
DIMENSIONS: MILLIMETERS
Unit
0.75
18X
PITCH
0.50
18X
0.30
CS51411/D