TDA8350Q/N6,112 NXP Semiconductors, TDA8350Q/N6,112 Datasheet - Page 12

• Manufacturer Part Number: TDA8350Q/N6,112
• Description: IC DC COUPLED V-DEFL 13-SIL
• Manufacturer: NXP Semiconductors

Specifications of TDA8350Q/N6,112

• Applications: *
• Mounting Type: Through Hole
• Package / Case: 13-SIL (Bent and Staggered Leads)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935262194112; TDA8350QU; TDA8350QU

Philips Semiconductors
SOLDERING
Plastic DIL-bent-SIL packages
B
The maximum permissible temperature of the solder is
260 C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
January 1995
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Y DIP OR WAVE
DC-coupled vertical deflection and
East-West output circuit
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
12
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
R
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 C, it must not be in contact for more than 10 s; if
between 300 and 400 C, for not more than 5 s.
EPAIRING SOLDERED JOINTS
Preliminary specification
TDA8350Q