6N134/883B#200 Avago Technologies US Inc., 6N134/883B#200 Datasheet - Page 6

• Manufacturer Part Number: 6N134/883B#200
• Description: OPTOCOUPLER HIGH CMR HERM 16DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of 6N134/883B#200

• Input Type: DC
• Package / Case: 16-DIP (0.300", 7.62mm)
• Voltage - Isolation: 1500VDC
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 10MBd
• Propagation Delay High - Low @ If: 55ns @ 13mA
• Current - Dc Forward (if): 20mA
• Output Type: Open Collector
• Mounting Type: Through Hole
• Isolation Voltage: 2500 Vrms
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 40 ns
• Maximum Forward Diode Current: 20 mA
• Maximum Rise Time: 90 ns
• Output Device: Logic Gate Photo IC
• Configuration: 2 Channel
• Current Transfer Ratio: 100 %
• Maximum Baud Rate: 10 MBps
• Maximum Forward Diode Voltage: 1.9 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 20 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Number Of Elements: 2
• Baud Rate: 10Mbps
• Forward Voltage: 1.9V
• Forward Current: 20mA
• Output Current: 25mA
• Package Type: PDIP
• Operating Temp Range: -55C to 125C
• Fall Time: 40ns
• Rise Time: 90ns
• Power Dissipation: 200mW
• Propagation Delay Time: 140ns
• Pin Count: 16
• Mounting: Through Hole
• Reverse Breakdown Voltage: 5V
• Operating Temperature Classification: Military
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Absolute Maximum Ratings
No derating required up to +125°C.
*Selection for higher output voltages up to 20 V is available
Single Channel Product Only
8 Pin Ceramic DIP Single Channel Schematic
ESD Classification
(MIL-STD-883, Method 3015)
Recommended Operating Conditions
*Meets or exceeds DSCC SMD and JEDEC requirements.
6
Parameter
Storage Temperature
Operating Temperature
Case Temperature
Junction Temperature
Lead Solder Temperature
Peak Forward Input Current
(each channel, ≤1 ms duration)
Average Input Forward Current (each channel)
Input Power Dissipation (each channel)
Reverse Input Voltage (each channel
Supply Voltage (1 minute maximum)
Output Current (each channel)
Output Voltage (each channel)
Output Power Dissipation (each channel)
Package Power Dissipation (each channel)
Enable Input Voltage
HCPL-5600/01/0K
6N134, 6N134/883B, HCPL-5630/31/3K, HCPL-5650/51, HCPL-6630/31/3K and HCPL-6650/51/5K
Parameter
Input Current, Low Level, Each Channel
Input Current, High Level, Each Channel*
Supply Voltage, Output
Fan Out (TTL Load) Each Channel
Symbol
I
I
V
N
FL
FH
CC
Note enable pin 7. An external 0.01 µF to 0.1 µF bypass capacitor must
be connected between V
V
Symbol
T
T
T
T
I
I
V
V
I
V
P
P
F(PEAK)
F(AVG)
O
E
A
S
C
J
R
CC
O
O
D
Min.
0
10
4.5
Min.
-65
-55
CC
and ground for each package type.
Max.
+150
+125
+170
+175
260 for 10 sec
40
20
35
5
7.0
25
7*
40
200
5.5
Max.
250
20
5.5
6
(D), Class 1
(Dot), Class 3
Units
µA
mA
V
Units
°C
°C
°C
°C
°C
mA
mA
mW
V
V
mA
V
mW
mW
V