PC357N3TJ00F Sharp Microelectronics, PC357N3TJ00F Datasheet - Page 10
![PHOTOCOUPLER 1CH TRAN OUT 4-SMD](/photos/22/87/228717/970751405-40_sml.jpg)
PC357N3TJ00F
Manufacturer Part Number
PC357N3TJ00F
Description
PHOTOCOUPLER 1CH TRAN OUT 4-SMD
Manufacturer
Sharp Microelectronics
Specifications of PC357N3TJ00F
Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD
No. Of Channels
1
Isolation Voltage
3.75kV
Input Current
20mA
Output Voltage
80V
Opto Case Style
Mini-Flat
No. Of Pins
4
Approval Bodies
UL
Approval Category
UL Recognised
Collector Emitter
RoHS Compliant
Configuration
1
Maximum Collector Emitter Voltage
80 V
Maximum Collector Emitter Saturation Voltage
200 mV
Current Transfer Ratio
600 %
Maximum Forward Diode Voltage
1.4 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
170 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 30 C
Forward Current
5 mA
Maximum Fall Time
18 us
Maximum Input Diode Current
50 mA
Maximum Reverse Diode Voltage
6 V
Maximum Rise Time
18 us
Output Device
Transistor
Optocoupler Output Type
Phototransistor
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PC357N3TJ00F
Manufacturer:
IXYS
Quantity:
2 928
Part Number:
PC357N3TJ00F
Manufacturer:
SHARP
Quantity:
20 000
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
10
3
Reflow
220˚C or more, 60s or less
4
(min)
PC357N Series
Sheet No.: D2-A00101EN