MT8VDDT6464HG-335D1 Micron Technology Inc, MT8VDDT6464HG-335D1 Datasheet - Page 27
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MT8VDDT6464HG-335D1
Manufacturer Part Number
MT8VDDT6464HG-335D1
Description
MODULE DDR SDRAM 512MB 200SODIMM
Manufacturer
Micron Technology Inc
Specifications of MT8VDDT6464HG-335D1
Memory Type
DDR SDRAM
Memory Size
512MB
Speed
167MHz
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
64Mx64
Total Density
512MByte
Chip Density
512Mb
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
1.4A
Number Of Elements
8
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
557-1127
Table 21: Serial Presence-Detect Matrix (Continued)
“1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW”; notes appear following matrix
NOTE:
pdf: 09005aef8092973f, source: 09005aef80921669
DD8C16_32_64x64HG.fm - Rev. B 9/04 EN
99-127 Manufacturer-Specific Data (RSVD)
48–61 Reserved
1. Value for -262 and -26A
2. The value of
3. The JEDEC SPD specification allows fast or slow slew rate values for these bytes. The worst-case (slow slew rate) value is
4. The value of
BYTE
36-40 Reserved
65-71 Manufacturer’s JEDEC IDCode
73-90 Module Part Number (ASCII)
95-98 Module Serial Number
30
31
32
33
34
35
41
42
43
44
45
46
47
62
63
64
72
91
92
93
94
represented here. Systems requiring the fast slew rate setup and hold values are supported, provided the faster mini-
mum slew rate is met.
SDRAM device specification is 15ns.
Minimum RAS# Pulse Width,
(see note 2)
Module Rank Density
Address and Command Setup Time,
t
Address and Command Hold Time,
t
Data/Data Mask Input Setup Time,
Data/Data Mask Input Hold Time,
Min Active Auto Refresh Time
Minimum Auto Refresh to Active/
Auto Refresh Command Period,
SDRAM Device Max Cycle Time,
t
SDRAM Device Max DQS-DQ Skew
Time,
SDRAM Device Max Read Data Hold
Skew Factor,
Reserved
DIMM Height
SPD Revision
Checksum for Bytes 0-62
Manufacturer’s JEDEC ID Code
Manufacturing Location
PCB Identification Code
Identification Code (Continued)
Year of Manufacture in BCD
Week of Manufacturein BCD
IS, (see note 3)
IH, (see note 3)
CK
MAX
t
DQSQ
t
t
RAS used for -262/-26A/-265 modules is calculated from
RP,
DESCRIPTION
t
RCD, and
t
QHS
t
CK set to 7ns (0x70) for optimum BIOS compatibility. Actual device spec. value is 7.5ns.
t
RAP for -335 modules indicated as 18ns to align with industry specifications; actual DDR
t
RAS,
t
RC
t
RFC
t
DH
t
DS
128MB, 256MB, 512MB
1.0ns (-262/-26A/-265)
1.0ns (-262/-26A/-265)
0.5ns (-262/-26A/-265)
0.5ns (-262/-26A/-265)
0.5ns (-262/-26A/-265)
0.75ns (-262/-26A/-265)
45ns (-262/-26A/-265)
75ns (-262-26A/-265)
13ns (-262-26A/265)
ENTRY (VERSION)
65ns (-26A/-265)
60ns (-335/-262)
0.45ns (-335)
0.45ns (-335)
0.45ns (-335)
0.55ns (-335)
(Continued)
0.8ns (-335)
0.8ns (-335)
42ns (-335)
72ns (-335)
12ns (-335)
Release 1.0
MICRON
01–12
-26A
-335
-262
-265
1–9
0
27
128MB, 256MB, 512MB (x64, SR)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT8VDDT1664H MT8VDDT3264H MT8VDDT6464H
Variable Data
Variable Data
Variable Data
Variable Data
t
RC -
01–0C
01–09
2A
2D
A0
A0
3C
4B
2D
D7
2C
20
80
80
45
50
45
50
00
41
48
30
34
32
55
75
00
01
00
10
04
04
34
00
t
FF
–
RP. Actual device spec. value is 40 ns.
200-PIN DDR SODIMM
Variable Data
Variable Data
Variable Data
Variable Data
01–0C
01–09
©2004 Micron Technology, Inc. All rights reserved.
2A
2D
A0
A0
2D
BA
3C
4B
2C
40
80
80
45
50
45
50
00
41
48
30
34
32
55
75
00
01
00
10
27
E7
17
00
FF
–
Variable Data
Variable Data
Variable Data
Variable Data
01–0C
01–09
2A
2D
A0
A0
2D
80
80
80
45
50
45
50
00
3C
41
48
4B
30
34
32
55
75
00
01
00
10
68
FB
28
58
2C
00
FF
–