MT8VDDT6464HG-40BD1 Micron Technology Inc, MT8VDDT6464HG-40BD1 Datasheet - Page 8
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MT8VDDT6464HG-40BD1
Manufacturer Part Number
MT8VDDT6464HG-40BD1
Description
MODULE DDR SDRAM 512MB 200SODIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT8VDDT3264HY-335K1.pdf
(15 pages)
Specifications of MT8VDDT6464HG-40BD1
Memory Type
DDR SDRAM
Memory Size
512MB
Speed
200MHz
Package / Case
200-SODIMM
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
557-1128
Electrical Specifications
Table 7:
PDF: 09005aef8092973f / Source: 09005aef80921669
DD8C32_64x64H.fm - Rev. D 9/08 EN
V
V
Symbol
DD
IN
, V
I
/V
T
OZ
I
A
I
DD
OUT
Q
Absolute Maximum Ratings
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
test = 0V)
Output leakage current; 0V ≤ V
disabled
DRAM ambient operating temperature
REF
DD
/V
Notes:
input 0V ≤ V
DD
Q supply voltage relative to V
Stresses greater than those listed in Table 7 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions outside those indicated on the device data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
1. For further information, refer to technical note
on Micron’s Web site.
IN
≤ 1.35V (All other pins not under
OUT
SS
256MB, 512MB (x64, SR) 200-Pin DDR SDRAM SODIMM
≤ V
SS
DD
1
IN
Q; DQ are
≤ V
DD
8
;
Address inputs,
RAS#, CAS#, WE#, BA,
S#, CKE
CK, CK#
DM
DQ, DQS
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
TN-00-08: “Thermal Applications,”
Electrical Specifications
Min
–1.0
–0.5
©2004 Micron Technology, Inc. All rights reserved.
–16
–40
–8
–2
–5
0
Max
+3.6
+3.2
+16
+70
+85
+8
+2
+5
available
Units
µA
µA
°C
°C
V
V