MT8VDDT6464AY-335D3 Micron Technology Inc, MT8VDDT6464AY-335D3 Datasheet - Page 20

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MT8VDDT6464AY-335D3

Manufacturer Part Number
MT8VDDT6464AY-335D3
Description
MODULE DDR 512MB 184-DIMM
Manufacturer
Micron Technology Inc

Specifications of MT8VDDT6464AY-335D3

Memory Type
DDR SDRAM
Memory Size
512MB
Speed
333MT/s
Package / Case
184-DIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
184UDIMM
Device Core Size
64b
Organization
64Mx64
Total Density
512MByte
Chip Density
512Mb
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
1.4A
Number Of Elements
8
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
184
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
pdf: 09005aef80867ab3, source: 09005aef80867a99
DD8C16_32_64x64AG.fm - Rev. G 9/04 EN
22. The valid data window is derived by achieving
23. Each byte lane has a corresponding DQS.
24. This limit is actually a nominal value and does not
25. To maintain a valid level, the transitioning edge of
refreshing or posting by the DRAM controller
greater than eight refresh cycles is not allowed.
other specifications:
(
directly porportional with the clock duty cycle
and a practical data valid window can be derived.
The clock is allowed a maximum duty cycle varia-
tion of 45/55, beyond which functionality is
uncertain. Figure 8, Derating Data Valid Window,
shows derating curves for duty cycles ranging
between 50/50 and 45/55.
result in a fail value. CKE is HIGH during
REFRESH command period (
CKE is LOW (i.e., during standby).
the input must:
a. Sustain a constant slew rate from the current
t
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
QH =
AC level through to the target AC level, V
or V
t
50/50
IH
HP -
3.750
2.500
(
AC
t
).
QHS). The data valid window derates
N/A
49.5/50.5
3.700
-335 @
-262/-26A/-265 @
-262/-26A/-265 @
2.463
t
HP (
t
CK = 6ns
t
Figure 8: Derating Data Valid Window
3.650
49/51
CK/2),
2.425
t
t
CK = 10ns
CK = 7.5ns
t
RFC [MIN]) else
t
DQSQ, and
48.5/52.5
3.600
2.388
IL
3.550
48/52
(
t
(
t
QH
AC
QH -
2.350
)
Clock Duty Cycle
20
t
DQSQ)
47.5/53.5
3.500
26. CK and CK# input slew rate must be ≥ 1V/ns (≤2V/
27. DQ and DM input slew rates must not deviate
28. V
29. The clock is allowed up to ±150ps of jitter. Each
30.
128MB, 256MB, 512MB (x64, SR)
2.313
ns differentially).
from DQS by more than 10 percent. If the DQ/
DM/DQS slew rate is less than 0.5V/ns, timing
must be derated: 50ps must be added to
t
slew rate exceeds 4 V/ns, functionality is uncer-
tain.
not active while any bank is active.
timing parameter is allowed to vary by the same
amount.
t
minimum actually applied to the device CK and
CK# inputs, collectively during bank active.
b. Reach at least the target AC level.
c. After the AC target level is reached, continue
DH for each 100mv/ns reduction in slew rate. If
HP min is the lesser of
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DD
184-PIN DDR SDRAM UDIMM
to maintain at least the target DC level, V
or V
47/53
3.450
must not vary more than 4 percent if CKE is
2.275
IH
(
DC
46.5/54.5
).
3.400
2.238
3.350
46/54
2.200
t
CL minimum and
45.5/55.5
3.300
©2004 Micron Technology. Inc.
2.163
t
3.250
45/55
DS and
IL
2.125
(
DC
t
CH
)

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