MT16LSDT12864AG-13EC1 Micron Technology Inc, MT16LSDT12864AG-13EC1 Datasheet - Page 19

• Manufacturer Part Number: MT16LSDT12864AG-13EC1
• Description: MODULE SDRAM 1GB 168DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT16LSDT12864AG-13EC1

• Memory Type: SDRAM
• Memory Size: 1GB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

PDF: 09005aef8088b2e3/Source: 09005aef8088077a
SD8_16C64_128x64AG.fm - Rev. C 6/05 EN
23. The clock frequency must remain constant (stable clock is defined as a signal cycling
24. Auto precharge mode only. The precharge timing budget (
25. Precharge mode only.
26. JEDEC and PC100 specify three clocks.
27.
28. Parameter guaranteed by design.
29. For -13E, CL = 2 and
30. CKE is HIGH during refresh command period
31. Refer to device data sheet for timing waveforms.
32. The value of
33. Leakage number reflects the worst case leakage possible through the module pin, not
within timing constraints specified for the clock pin) during access or precharge
states (READ, WRITE, including
used to reduce the data rate.
and 7.5ns for -133 after the first clock delay, after the last WRITE is executed. May not
exceed limit set for precharge mode.
t
limit is actually a nominal value and does not result in a fail value.
what each memory device contributes.
AC for -133/-13E at CL = 3 with no load is 4.6ns and is guaranteed by design.
t
RAS used in -13E speed grade modules is calculated from
512MB (SR), 1GB (DR): (x64) 168-Pin SDRAM UDIMM
t
CK = 7.5ns; and for -133, CL = 3 and
19
t
WR, and PRECHARGE commands). CKE may be
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
RFC (MIN) else CKE is LOW. The I
t
CK = 7.5ns.
t
RP) begins 7ns for -13E,
©2002 Micron Technology, Inc. All rights reserved.
t
RC -
t
RP.
Notes
DD
6