MT9HTF3272Y-667B3 Micron Technology Inc, MT9HTF3272Y-667B3 Datasheet - Page 11

• Manufacturer Part Number: MT9HTF3272Y-667B3
• Description: MODULE DDR2 256MB 240-DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9HTF3272Y-667B3

• Memory Type: DDR2 SDRAM
• Memory Size: 256MB
• Speed: 667MT/s
• Package / Case: 240-DIMM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

DRAM Operating Conditions
Table 9: Module and Component Speed Grades
DDR2 components may exceed the listed module speed grades; module may not be available in all listed speed grades
Design Considerations
PDF: 09005aef82250868
htf9c32_64_128x72.pdf - Rev. F 3/10 EN
Module Speed Grade
-1GA
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron's Web site. Module speed grades cor-
relate with component speed grades.
-80E
-800
-667
-53E
-40E
Simulations
Micron memory modules are designed to optimize signal integrity through carefully de-
signed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level. Mi-
cron encourages designers to simulate the signal characteristics of the system's memo-
ry bus to ensure adequate signal integrity of the entire memory system.
Power
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to en-
sure the required supply voltage is maintained.
256MB, 512MB, 1GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Component Speed Grade
DRAM Operating Conditions
-187E
-25E
-37E
-25
-5E
-3
© 2003 Micron Technology, Inc. All rights reserved.