MT4JSF6464HY-1G4B1 Micron Technology Inc, MT4JSF6464HY-1G4B1 Datasheet - Page 2

MOD DDR3 SDRAM 512MB 204-SODIMM

MT4JSF6464HY-1G4B1

Manufacturer Part Number
MT4JSF6464HY-1G4B1
Description
MOD DDR3 SDRAM 512MB 204-SODIMM
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT4JSF6464HY-1G4B1

Memory Type
DDR3 SDRAM
Memory Size
512MB
Speed
1333MT/s
Package / Case
204-SODIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Depth, Width
The part numbering system is available at www.micron.com/support/designsupport/documents/png
Micron Technology
Number of
Memory Components
Process Technology
H = 1.8V
G = 1.5V
R = 1.55V
Product Family
TF = FBGA
TS = DDP (dual die in package)
TZS = Heatspreader DDP
VF = VLP (very low profile)
VS = VLP DDP
VZS = VLP Heatspreader DDP
VQ = VLP QDP
Device Number
Blank = Megabits
Module Version
Blank = 240-pin registered DIMM
Rev. 8/6/09
DDR2 Module Part Numbering System
© 2009 Micron Technology, Inc.
Micron and the Micron logo are trademarks of Micron Technology, Inc.
Products and specifications are subject to change without notice. Dates are
estimates only.
CH = 200-pin SOCDIMM
G = Gigabits
PK = 244-pin Parity MiniRDIMM
RH = 200-pin SORDIMM
A = 240-pin unbuffered DIMM
F = 240-pin fully buffered DIMM
H = 200-pin SODIMM
P = Parity
DDR2 SDRAM modules
MT
16
H
TF
256
64
A
Pb-Free
Y - 667
Device Package Descriptions
TY
Y
Z
DY
DZ
IY
DDR2 SDRAM Modules
SPD = serial presence-detect pin (module only)
CL = CAS latency;
Package Codes
Module
Speed
Grade
-40E
-53E
-667
-80E
-800
-1GA
Commercial temp; single- or dual-rank DIMM
Halogen-free; commercial temp; single- or dual-rank DIMM
Commercial temp; select dual-rank
Halogen-free; commercial temp; select dual- or quad-rank DIMM
Industrial temp, select dual-rank DIMM
Industrial temp; select dual-rank DIMM
Module Speed
-187E
Component
Speed Grade/
Part Mark
-5E
-37E
-3
-25E
-25
t
E
RCD = active-to-command time;
1
JEDEC
Component
Speed Grade
DDR2-400
DDR2-533
DDR2-667
DDR2-800
DDR2-800
DDR2-1066
Printed Circuit Board
Revision Designator
Die Revision
AMB Vendor*
E = Intel
D = IDT
N = NEC
Clock
Frequency
(MHz)
200
267
333
400
400
533
t
RP = precharge time
AMB Vendor Rev*
*Applies to FBDIMM modules only
Data
Rate
(MT/s)
400
533
667
800
800
1066
Module
Bandwidth SPD (CL-
PC2-3200
PC2-4200
PC2-5300
PC2-6400
PC2-6400
PC2-8500
Module
Configuration
3-3-3
4-4-4
5-5-5
5-5-5
6-6-6
7-7-7
t
RCD-
t
RP)

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