HFBR-2119TZ Avago Technologies US Inc., HFBR-2119TZ Datasheet - Page 2

• Manufacturer Part Number: HFBR-2119TZ
• Description: RECEIVER FIBER OPTIC ST 266MBD
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-2119TZ

• Voltage - Supply: 4.5 V ~ 5.5 V
• Power - Minimum Receivable: -28dBm
• Current - Supply: 185mA
• Applications: General Purpose
• Function: Fiber Channel applications or for general purpose fiber optic data link transmission
• Product: Receiver
• Data Rate: 266 MBd
• Wavelength: 1380 nm (Max)
• Maximum Rise Time: 2.2 ns
• Maximum Fall Time: 2.2 ns
• Pulse Width Distortion: 0.97 ns
• Maximum Output Current: 50 mA
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Package / Case: DIP With Connector
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: Multimode Glass
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-2051

Figure 1. Transmitter and receiver block diagram.
Figure 2. Package outline drawing.
2
DIFFERENTIAL
DATA IN
DIFFERENTIAL
SIGNAL
DETECT OUT
DIFFERENTIAL
DATA IN
V
NOTES:
1. MATERIAL ALLOY 194 1/2H – 0.38 THK
2. MATERIAL PHOSPHOR BRONZE WITH
3. UNITS = mm
BB
FINISH MATTE TIN PLATE 7.6 µm MIN.
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.
5.0
ELECTRICAL
SUBASSEMBLIES
TRANSMITTER
QUANTIZER
RECEIVER
DRIVER IC
IC
TOP VIEW
8.31
7.01
PREAMP IC
5.05
2.45
19.72
12
41 MAX.
OPTICAL
SUBASSEMBLIES
PIN PHOTODIODE
LED
(7 x 2.54)
17.78
HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE
THREADS
3/8 – 32 UNEF-2A
SIMPLEX ST
RECEPTACLE
0.9
8 x 7.62
12.19
MAX.
PCB PINS
DIA. 0.46 mm
NOTE 2
HOUSING PINS 0.38 x 0.5 mm
NOTE 1
®
9.8 MAX.
The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from
other vendors.
The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.
The electrical subassemblies con-
sist of a multi-layer printed circuit
board on which the IC chips and
various surface-mounted, passive
circuit elements are attached.
3