SW001A2B91Z Lineage Power, SW001A2B91Z Datasheet - Page 21

• Manufacturer Part Number: SW001A2B91Z
• Description: CONVERTER DC/DC 12V 1.2A OUT T/H
• Manufacturer: Lineage Power
• Series: SWr
• Type: Isolated with Remote On/Offr

Specifications of SW001A2B91Z

• Output: 12V
• Number Of Outputs: 1
• Power (watts): 14W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 6-DIP Module
• 1st Output: 12 VDC @ 1.2A
• Size / Dimension: 1.10" L x 0.96" W x 0.34" H (27.9mm x 24.4mm x 8.6mm)
• Power (watts) - Rated: 14W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 87%
• Approvals: CE, CSA, UL, VDE
• Output Power: 14 W
• Input Voltage Range: 36 V to 75 V
• Input Voltage (nominal): 54 V
• Output Voltage (channel 1): 12 V
• Output Current (channel 1): 1.2 A
• Isolation Voltage: 2.25 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 12 V
• Product: Isolated
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 555-1115; CC109107356

Data Sheet
October 5, 2009
The SW/SC family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT)
soldering.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. They are designed to be
processed through single or dual wave soldering
machines. The pins have an RoHS-compliant finish
that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of
3°C/s is suggested. The wave preheat process
should be such that the temperature of the power
module board is kept below 210°C. For Pb solder,
the recommended pot temperature is 260°C, while the
Pb-free solder pot is 270°C max. Not all RoHS-
compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process.
If additional information is needed, please consult with
your Lineage Power representative for more details.
Surface Mount Information
Pick and Place
The SW/SC-SR series of DC-to-DC power converters
use an open-frame construction and are designed for
surface mount assembly within a fully automated
manufacturing process.
The SW/SC-SR series modules are designed to use
the main magnetic component surface to allow for
pick and place.
Note: All dimensions in mm.
Figure 52. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is
7.50mm nominal with an RSS tolerance of +/-0.25
mm.
LINEAGE
POWER
12.70
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
Ø6.5 NOZZLE.
SW/SC001/003 Series DC-DC Power Module:
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 5mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be
used within the space available.
For further information please contact your local
Lineage Power Technical Sales Representative.
Reflow Soldering Information
These power modules are large mass, low thermal
resistance devices and typically heat up slower
than other SMT components. It is recommended
that the customer review data sheets in order to
customize the solder reflow profile for each
application board assembly.
The following instructions must be observed when
SMT soldering these units. Failure to observe
these instructions may result in the failure of or
cause damage to the modules, and can adversely
affect long-term reliability.
The surface mountable modules in the SW/SC
family use our SMT technology called “Column Pin”
(CP) connectors. Figure 53 shows the CP
connector before and after reflow soldering onto the
end-board assembly.
Figure 53. Column Pin Connector Before and
After Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn
Sn/Ag
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint.
3.8
o
C (Sn/Pb solder) or 217-218
/Cu
63
0.7
/Pb
(SAC) solder for –Z codes. The CP
Power Module Board
37
Solder Ball
) solder for non-Z codes, or
Insulator
End assembly PCB
o
C (SAC solder),
21