SW001A2B91Z Lineage Power, SW001A2B91Z Datasheet - Page 22

• Manufacturer Part Number: SW001A2B91Z
• Description: CONVERTER DC/DC 12V 1.2A OUT T/H
• Manufacturer: Lineage Power
• Series: SWr
• Type: Isolated with Remote On/Offr

Specifications of SW001A2B91Z

• Output: 12V
• Number Of Outputs: 1
• Power (watts): 14W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 6-DIP Module
• 1st Output: 12 VDC @ 1.2A
• Size / Dimension: 1.10" L x 0.96" W x 0.34" H (27.9mm x 24.4mm x 8.6mm)
• Power (watts) - Rated: 14W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 87%
• Approvals: CE, CSA, UL, VDE
• Output Power: 14 W
• Input Voltage Range: 36 V to 75 V
• Input Voltage (nominal): 54 V
• Output Voltage (channel 1): 12 V
• Output Current (channel 1): 1.2 A
• Isolation Voltage: 2.25 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 12 V
• Product: Isolated
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 555-1115; CC109107356

Data Sheet
October 5, 2009
Surface Mount Information
There are several types of SMT reflow technologies
currently used in the industry. These surface
mount power modules can be reliably soldered
using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. The
recommended linear reflow profile using Sn/Pb
solder is shown in Figure 54 and 55. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules
CP connector temperatures.
Figure 54. Recommended Reflow Profile for Sn/Pb
solder.
Figure 55. Time Limit, T
Reflow .
Lead Free Soldering
The –Z version SMT modules of the SW/SC series
are lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
LINEAGE
300
200
240
235
230
225
220
205
200
250
1 00
215
210
1 50
50
0
0
POWER
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
TIME LIMIT (S)
o
So ak zo ne
30-240s
Cs
-1
lim
-1
, Curve Above 205
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
30
o
C
T
205
40
lim
o
above
(continued)
C
Co o ling
zo ne
1 -4
50
o
Cs
-1
o
C
60
SW/SC001/003 Series DC-DC Power Module:
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 56.
Figure 56. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The SW/SC series SMT modules have a MSL rating
of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
22