JW030F1-M Lineage Power, JW030F1-M Datasheet - Page 17

• Manufacturer Part Number: JW030F1-M
• Description: CONVERT DC/DC 3.3V 21.5W OUT
• Manufacturer: Lineage Power
• Series: JW030r
• Type: Isolated with Remote On/Offr

Specifications of JW030F1-M

• Output: 3.3V
• Number Of Outputs: 1
• Power (watts): 30W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 9-DIP Module
• 1st Output: 3.3 VDC @ 6.5A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 21.5W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 75%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: No

March 26,2008
Thermal Considerations
Heat Sink Selection
Figure 35. Case-to-Ambient Thermal Resistance
Lineage Power
8
7
6
5
4
3
2
1
0
0
vs. Air Velocity Curves; Either
Orientation
0.25
(50)
(100)
0.51
AIR VELOCITY, ms
(150)
0.76
(continued)
(200)
NO HEAT SINK
1/4 in. HEAT SINK
1/2 in. HEAT SINK
1 in. HEAT SINK
1 1/2 in. HEAT SINK
1.02
(250)
(continued)
1.27
-1
(ft./min.)
(300)
1.52
(350)
1.78
8-1052(C).a
(400)
2.03
Although the previous example uses 100 °C as the
maximum case temperature, for extremely high reliabil-
ity applications, one can use a lower temperature for
T
It is important to point out that the thermal resistances
shown in Figure 35 are for heat transfer from the sides
and bottom of the module as well as the top side with
the attached heat sink; therefore, the case-to-ambient
thermal resistances shown will generally be lower than
the resistance of the heat sink by itself. The data in Fig-
ure 35 was taken with a thermally conductive dry pad
between the case and the heat sink to minimize contact
resistance (typically 0.1 °C/W to 0.3 °C/W).
For a more detailed explanation of thermal energy
management for this series of power modules as well
as more details on available heat sinks, please request
the following technical note: Thermal Energy Manage-
ment for JC- and JW-Series 30 Watt Board-Mounted
Power Modules (TN97-016EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs.
C, max
.
36 Vdc to 75 Vdc Inputs; 30 W
17