AXA010A0X3 Lineage Power, AXA010A0X3 Datasheet - Page 16
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AXA010A0X3
Manufacturer Part Number
AXA010A0X3
Description
CONVER DC/DC 0.75 5.5V @ 10A SIP
Manufacturer
Lineage Power
Series
Austin Lynx™r
Type
Point of Load (POL) Non-Isolated with Remote On/Offr
Datasheet
1.AXA010A0X3Z.pdf
(19 pages)
Specifications of AXA010A0X3
Rohs Status
RoHS non-compliant
Output
0.75 ~ 5.5V
Number Of Outputs
1
Power (watts)
55W
Mounting Type
Through Hole
Voltage - Input
10 ~ 14V
Package / Case
10-SIP Module
1st Output
0.75 ~ 5.5 VDC @ 10A
Size / Dimension
2.00" L x 0.32" W x 0.50" H (50.8mm x 8.1mm x 12.7mm)
Power (watts) - Rated
55W
Operating Temperature
-40°C ~ 85°C
Efficiency
93%
Approvals
CSA, EN, UL, VDE
Product
Non-Isolated / POL
3rd Output
-
2nd Output
-
Lead Free Status / Rohs Status
No RoHS Version Available
Other names
555-1013
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AXA010A0X3-SR
Manufacturer:
JAM
Quantity:
1 200
Part Number:
AXA010A0X3-SR
Manufacturer:
LINEAGEPO
Quantity:
20 000
Company:
Part Number:
AXA010A0X3-SRZ
Manufacturer:
SEC
Quantity:
3
TM
Data Sheet
12V Austin Lynx
SIP Non-isolated Power Modules, Programmable:
September 30, 2009
10Vdc – 14Vdc input; 0.75Vdc to 5.5Vdc Output;10A Output Current
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3°C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210°C. For Pb
solder, the recommended pot temperature is 260°C,
while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be
processed with paste-through-hole Pb or Pb-free reflow
process. If additional information is needed, please
consult with your Lineage Power technical
representative for more details.
LINEAGE
POWER
16