ATM030A0X3-SRHZ Lineage Power, ATM030A0X3-SRHZ Datasheet - Page 21

• Manufacturer Part Number: ATM030A0X3-SRHZ
• Description: CONVERTER DC-DC 0.8 2VDC @ 30A
• Manufacturer: Lineage Power
• Series: Austin MegaLynx™r
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of ATM030A0X3-SRHZ

• Output: 0.8 ~ 2V
• Number Of Outputs: 1
• Power (watts): 60W
• Mounting Type: Surface Mount
• Voltage - Input: 2.7 ~ 4V
• Package / Case: 5-SMD Module
• 1st Output: 0.8 ~ 2 VDC @ 30A
• Size / Dimension: 1.30" L x 0.36" W x 0.53" H (33mm x 9.1mm x 13.5mm)
• Power (watts) - Rated: 60W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 92%
• Approvals: CSA, EN, UL, VDE
• Output Power: 60 W
• Input Voltage Range: 2.7 V to 4 V
• Output Voltage (channel 1): 0.8 V to 2 V
• Output Current (channel 1): 30 A
• Package / Case Size: SMD
• Output Type: Non-Isolated
• Output Voltage: 0.8 V to 2 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: Q5188004

Data Sheet
October 21, 2009
Surface Mount Information
Lead Free Soldering
The –Z version MegaLynx ATM SMT modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 39.
MSL Rating
The Austin MegaLynx
MSL rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
LINEAGE
POWER
TM
ATM SMT modules have a
Austin MegaLynx
(continued)
2.7 – 4.0Vdc input; 0.8 to 2.0Vdc Output; 30A output current
TM
SMT: Non-Isolated DC-DC Power Modules:
Modules: Soldering and Cleaning Application Note
(AN04-001).
Figure 39. Recommended linear reflow profile
using Sn/Ag/Cu solder.
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
21