CY3276 Cypress Semiconductor Corp, CY3276 Datasheet - Page 3

• Manufacturer Part Number: CY3276
• Description: DEV PROG POWERLINE HIGH EZCOLOR
• Manufacturer: Cypress Semiconductor Corp
• Type: Other Power Managementr

Specifications of CY3276

• Mfg Application Notes: Powerline Comm Brd Design AppNote
• Main Purpose: Interface, Transceiver, Powerline Communication
• Embedded: No
• Utilized Ic / Part: CY8CLED16P01
• Primary Attributes: 2400bps Data Transfer Over High Voltage Power Lines
• Secondary Attributes: User Configurable LEDs
• Board Size: 127 mm x 101.6 mm
• Interface Type: RS-232, Ethernet, I2C, ISSP
• Maximum Operating Temperature: + 40 C
• Operating Supply Voltage: 110 V to 240 V
• Product: Power Management Development Tools
• Dimensions: 127 mm x 101.6 mm
• Silicon Manufacturer: Cypress
• Silicon Core Number: CY8CLED16P01
• Kit Application Type: Communication & Networking
• For Use With/related Products: CY8CLED16P01
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 428-3004

CY3276 Cypress High Voltage Programmable PLC Development Kit Guide, Doc. # 001-55116 Rev. *B
Contents
1. Introduction
2. PLC Development Board
Appendix
1.1
1.2
1.3
1.4
1.5
1.6
2.1
2.2
2.3
A.1 Schematics ...................................................................................................................21
A.2 Layout ...........................................................................................................................25
A.3 Bill of Materials ............................................................................................................31
Safety precautions .......................................................................................................5
Using the PLC Kit ........................................................................................................5
The Cypress PLC Solution ..........................................................................................5
1.3.1 Cypress PLC Features.....................................................................................6
Kit Contents .................................................................................................................7
Document Revision History ........................................................................................8
Documentation Conventions .......................................................................................8
Features.......................................................................................................................9
PLC Development Board Functional Overview ...........................................................9
2.2.1 Operating Conditions: ......................................................................................9
Hardware Description ................................................................................................10
2.3.1 High Voltage Section with SMPS ...................................................................11
2.3.2 Transmit Amplifier and Filtering Section.........................................................11
2.3.3 Transmit and Receive Coupling Circuit ..........................................................11
2.3.4 Development ..................................................................................................12
2.3.5 Daughter Cards with the Board......................................................................15
2.3.6 RJ45 Connector for Debugging......................................................................18
2.3.7 RS232 COM Port ...........................................................................................18
A.1.1 Board Overview ...............................................................................................21
A.1.2 User Interface ..................................................................................................22
A.1.3 Transmit and Receive Filters ...........................................................................23
A.1.4 Power Supply ..................................................................................................24
A.2.1 Top Layer ........................................................................................................25
A.2.2 Ground Layer ..................................................................................................26
A.2.3 Power Layer ....................................................................................................27
A.2.4 Bottom Layer ...................................................................................................28
A.2.5 Top Silkscreen .................................................................................................29
A.2.5 Bottom Silkscreen ...........................................................................................30
2.3.4.1 Bread Board.....................................................................................12
2.3.4.2 CY8CLED16P01 Device ..................................................................12
2.3.4.3 Potentiometer and Dip Switches......................................................14
2.3.5.1 LED Daughter Card .........................................................................15
2.3.5.2 LCD Daughter Card .........................................................................17
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