ATA6613-EK Atmel, ATA6613-EK Datasheet - Page 4
ATA6613-EK
Manufacturer Part Number
ATA6613-EK
Description
BOARD DEMO LIN-MCM FOR ATA6613
Manufacturer
Atmel
Specifications of ATA6613-EK
Main Purpose
Interface, LIN + MCU
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
ATA6613
Primary Attributes
LIN-SBC (System-Basis-Chip) Transceiver, LIN 2.0, Voltage Regulator, Window Watchdog
Secondary Attributes
16 kB Flash, 4 Power Modes: Pre-Normal, Normal, Sleep, Silent, 48-QFN
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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Table 2-2.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
4
Parameters
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
CDM ESD STM 5.3.1
Storage temperature
Operating temperature
Thermal resistance junction to heat slug
Thermal resistance junctiion to ambient
Thermal shutdown of VCC regulator
Thermal shutdown of LIN output
Thermal shutdown hysteresis
Note:
1. T
Atmel ATA6612/ATA6613
application.
case
Maximum Ratings of the SiP
means the temperature of the heat slug (backside). It is mandatory that this backside temperature is 125°C in the
(1)
Symbol
T
R
R
T
case
thjc
thja
s
±750
Min.
–55
–40
150
150
±2
Typ.
165
165
30
10
6
Max.
+150
+125
170
170
9111H–AUTO–01/11
Unit
K/W
K/W
KV
°C
°C
°C
°C
°C
V
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