MCP651EV-VOS Microchip Technology, MCP651EV-VOS Datasheet - Page 41

• Manufacturer Part Number: MCP651EV-VOS
• Description: BOARD EVAL OP AMP MCP651
• Manufacturer: Microchip Technology
• Series: mCal Technologyr

Specifications of MCP651EV-VOS

• Channels Per Ic: 1 - Single
• Amplifier Type: General Purpose
• Output Type: Single-Ended, Rail-to-Rail
• Slew Rate: 30 V/µs
• Current - Output / Channel: 100mA
• Operating Temperature: -40°C ~ 125°C
• Current - Supply (main Ic): 6mA
• Voltage - Supply, Single/dual (±): 2.5 V ~ 5.5 V
• Board Type: Fully Populated
• Utilized Ic / Part: MCP651
• Processor To Be Evaluated: MCP651
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V to 5.5 V
• Tool Type: Evaluation Board
• Core Architecture: PIC
• Cpu Core: PIC
• Data Bus Width: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2008 Microchip Technology Inc.
PART NO.
Device:
Temperature Range:
Package:
Device
Temperature
Range
–X
MCP6V01
MCP6V01T Single Op Amp
MCP6V02
MCP6V02T Dual Op Amp
MCP6V03
MCP6V03T Single Op Amp with Chip Select
E
MD
MNY * = Plastic Dual Flat No Lead (2x3x0.75 mm), 8-lead
SN
* Y = nickel palladium gold manufacturing designator. Only
= -40°C to +125°C
= Plastic Dual Flat, No-Lead (4×4x0.9 mm), 8-lead
= Plastic SOIC (150mil Body), 8-lead
available on the TDFN package.
(MCP6V02 only)
(MCP6V01, MCP6V03)
Package
Single Op Amp
(Tape and Reel for 2x3 TDFN andSOIC)
Dual Op Amp
(Tape and Reel for 4×4 DFN and SOIC)
Single Op Amp with Chip Select
(Tape and Reel for SOIC)
/XXX
Examples:
a)
b)
a)
b)
a)
b)
MCP6V01T-E/SN: Extended temperature,
MCP6V01-E/MNY:Extended temperature,
MCP6V02-E/MD: Extended temperature,
MCP6V02T-E/SN: Tape and Reel,
MCP6V03-E/SN: Extended temperature,
MCP6V03-E/MNY:Extended temperature,
MCP6V01/2/3
.
8LD SOIC package.
8LD 2x3 TDFN package.
8LD 4x4 DFN package.
Extended temperature,
8LD SOIC package.
8LD SOIC package.
8LD 2x3 TDFN package.
DS22058C-page 43