DM163022 Microchip Technology, DM163022 Datasheet - Page 15

• Manufacturer Part Number: DM163022
• Description: BOARD DEMO PICDEM-2 PLUS
• Manufacturer: Microchip Technology
• Type: MCUr

Specifications of DM163022

• Contents: Board, CD, Sample Part
• Processor To Be Evaluated: PIC 16 and PIC 18
• Interface Type: RS-232
• Silicon Manufacturer: Microchip
• Core Architecture: PIC
• Core Sub-architecture: PIC16, PIC18
• Silicon Core Number: PIC16F, PIC18F
• Silicon Family Name: PIC16F8xx, PIC18F4xxx
• Rohs Compliant: NA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: PICDEM 2 Plus
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DM163022R; DM163022R

2.3
© 2005 Microchip Technology Inc.
GETTING STARTED
This section presents an overview of the following system blocks:
• The MCP212X Developer’s Daughter Board Hardware
• The MCP212X Developer’s Daughter Board Firmware
2.3.1
The major components for the MCP212X Developer’s Daughter Board are:
1. MCP2122 device (U4)
2. MCP2120 device socket (U1)
3. Optical transceiver (U5 – Vishay TFDU 4300)
4. Headers H1 and H2
5. Header H3
6. Header HD1
7. Jumpers to route the TX, RX and 16XCLK signals
8. Jumpers to select the baud rate and mode
9. Footprint for two different optional optical transceiver circuits
10. MCP2120 crystal (Y2)
The MCP212X Developer’s Daughter Board is assembled and tested to allow for the
evaluation and demonstration of the MCP2122 or MCP2120 features. A schematic of the
circuit, as well as the corresponding PCB layout, is shown in Appendix A. “Schematic
and Layouts”. Appendix B. “Bill of Materials (BOM)” shows two tables; the first is the
components that are installed, while the second lists the optional components that are not
installed.
The component layout floor plan is shown in Figure 2-1.
(Vishay TFDU 4100 and Agilent HSDL 3000)
The MCP212X Developer’s Daughter Board Hardware Overview
Installation and Operation
DS51571A-page 11