C8051T606DK Silicon Laboratories Inc, C8051T606DK Datasheet - Page 27

• Manufacturer Part Number: C8051T606DK
• Description: KIT DEVELOPMENT FOR C8051T606
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051T606DK

• Contents: Board, Adapter, Cable, CD, Power Supply
• Processor To Be Evaluated: C8051T606x
• Interface Type: RS-232, USB
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051T606
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1666

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ASME Y14.5M-1994.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
(LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
Small Body Components.
C1
G1
E
Table 6.2. MSOP-10 PCB Land Pattern Dimensions
Figure 6.2. MSOP-10 PCB Land Pattern
3.00
Min
4.40 REF
0.50 BSC
Max
—
Rev. 1.2
Dimension
C8051T600/1/2/3/4/5/6
X1
Y1
Z1
Min
—
—
1.40 REF
Max
0.30
5.80
27