C8051T606DK Silicon Laboratories Inc, C8051T606DK Datasheet - Page 6

• Manufacturer Part Number: C8051T606DK
• Description: KIT DEVELOPMENT FOR C8051T606
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051T606DK

• Contents: Board, Adapter, Cable, CD, Power Supply
• Processor To Be Evaluated: C8051T606x
• Interface Type: RS-232, USB
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051T606
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1666

C8051T600/1/2/3/4/5/6
List of Figures
1. System Overview
2. Ordering Information
3. Pin Definitions
4. QFN-11 Package Specifications
5. SOIC-14 Package Specifications
6. MSOP-10 Package Specifications
7. QFN-10 Package Specifications
8. Electrical Characteristics
9. 10-Bit ADC (ADC0, C8051T600/2/4 only)
10. Temperature Sensor (C8051T600/2/4 only)
11. Voltage Reference Options
12. Voltage Regulator (REG0)
6
Figure 1.1. C8051T600/2/4 Block Diagram ............................................................. 14
Figure 1.2. C8051T601/3/5 Block Diagram ............................................................. 14
Figure 1.3. C8051T606 Block Diagram ................................................................... 15
Figure 3.1. C8051T600/1/2/3/4/5-GM QFN11 Pinout Diagram (Top View) ............. 19
Figure 3.2. C8051T600/1/2/3/4/5-GS SOIC14 Pinout Diagram (Top View) ............ 19
Figure 3.3. C8051T606-GM QFN11 Pinout Diagram (Top View) ............................ 20
Figure 3.4. C8051T606-GT MSOP10 Pinout Diagram (Top View) .......................... 20
Figure 3.5. C8051T606-ZM QFN10 Pinout Diagram (Top View) ............................ 21
Figure 4.1. QFN-11 Package Drawing .................................................................... 22
Figure 4.2. QFN-11 PCB Land Pattern .................................................................... 23
Figure 5.1. SOIC-14 Package Drawing ................................................................... 24
Figure 5.2. SOIC-14 Recommended PCB Land Pattern ......................................... 25
Figure 6.1. MSOP-10 Package Drawing ................................................................. 26
Figure 6.2. MSOP-10 PCB Land Pattern ................................................................. 27
Figure 7.1. QFN-10 Package Drawing .................................................................... 28
Figure 7.2. QFN-10 PCB Land Pattern .................................................................... 29
Figure 8.1. C8051T600/1/2/3/4/5 Normal Mode Supply Current vs. Frequency
Figure 8.2. C8051T606 Normal Mode Supply Current vs. Frequency (MPCE = 1) 38
Figure 8.3. C8051T600/1/2/3/4/5 Idle Mode Supply Current vs. Frequency
Figure 8.4. C8051T606 Idle Mode Digital Current vs. Frequency (MPCE = 1) ....... 39
Figure 9.1. ADC0 Functional Block Diagram ........................................................... 40
Figure 9.2. 10-Bit ADC Track and Conversion Example Timing ............................. 42
Figure 9.3. ADC0 Equivalent Input Circuits ............................................................. 43
Figure 9.4. ADC Window Compare Example: Right-Justified Data ......................... 49
Figure 9.5. ADC Window Compare Example: Left-Justified Data ........................... 49
Figure 9.6. ADC0 Multiplexer Block Diagram .......................................................... 50
Figure 10.1. Temperature Sensor Transfer Function .............................................. 52
Figure 10.2. Temperature Sensor Error with 1-Point Calibration at 0 °C ................ 53
Figure 11.1. Voltage Reference Functional Block Diagram ..................................... 55
(MPCE = 1) ........................................................................................................ 38
(MPCE = 1) ........................................................................................................ 39
Rev. 1.2