MPC8536E-ANDROID Freescale Semiconductor, MPC8536E-ANDROID Datasheet - Page 112

• Manufacturer Part Number: MPC8536E-ANDROID
• Description: HARDWARE/SOFTWARE ANDROID OS
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC ™r
• Type: MPUr

Specifications of MPC8536E-ANDROID

• Contents: Board
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal
The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part
in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the
part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat
sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to
determine the optimal grid for their specific case.
2.24.3
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
112
Thermal Management Information
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
Figure 72. System Level Thermal Model for MPC8536E (Not to Scale)
Conductivity
Kx
Ky
Kz
Table 80. MPC8536E Thermal Model (continued)
Solder and Air (29 × 29 × 0.5 mm)
Value
0.034
0.034
12.1
W/m•K
Units
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