PPC8544EVTANG Freescale Semiconductor, PPC8544EVTANG Datasheet - Page 81
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PPC8544EVTANG
Manufacturer Part Number
PPC8544EVTANG
Description
EVAL MPC8544 783FCPBGA
Manufacturer
Freescale Semiconductor
Type
Microcontrollerr
Datasheet
1.MPC8544VTALF.pdf
(117 pages)
Specifications of PPC8544EVTANG
Contents
Board
For Use With/related Products
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PPC8544EVTANG
Manufacturer:
FREESCALE
Quantity:
20 000
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18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in
Freescale Semiconductor
Package Parameters for the MPC8544E FC-PBGA
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball (Pb-free)
Note:
1. (FC-PBGA) without a lid.
Table 61. Package Parameters
Parameter
29 mm × 29 mm
96.5% Sn
3.5% Ag
PBGA
0.6 mm
1 mm
783
1
Table
Package Description
61.
81
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