isp1106 NXP Semiconductors, isp1106 Datasheet
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isp1106 Summary of contents
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... Mbit/s) and low-speed (1.5 Mbit/s) data rates. ISP1105 allows single/differential input modes selectable by a MODE input and it is available in HBCC16 package. ISP1106 allows only differential input mode and is available in both TSSOP16 and HBCC16 packages. ISP1107 allows only single-ended input mode and is available in both TSSOP16 and HBCC16 packages. ...
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... TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm ISP1107DH [1] The ground terminal of ISP1105W is connected to the exposed diepad (heatsink). 4.1 Ordering options Table 2: Selection guide Product Package(s) ISP1105 HBCC16 ISP1106 TSSOP16 or HBCC16 ISP1107 TSSOP16 or HBCC16 [1] Refer to Table 5 and Table 6. [2] Refer to Table 6 ...
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... Philips Semiconductors 5. Functional diagram (1) Use a 39 (2) Connect to D for low-speed operation. (3) Pin function depends on device type see (4) Only for ISP1105. Fig 1. Functional diagram (combined ISP1105, ISP1106 and ISP1107). 9397 750 08872 Product data 3 CC(I/O) REGULATOR SOFTCON OE SPEED (3) VMO/FSE0 (3) VPO/VO (4) MODE LEVEL ...
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... RCV (exposed diepad Bottom view Fig 2. Pinning diagram HBCC16 (ISP1105). The asterisk (*) denotes that the signal names VO and FSE0 apply to the ISP1107DH. Fig 4. Pinning diagram TSSOP16 (ISP1106 and ISP1107). 9397 750 08872 Product data D 9 SUSPND VPO/VO ...
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... VMO/FSE0 12 12 9397 750 08872 Product data Type Description ISP1106/7 TSSOP16 3 I input for output enable (CMOS level with respect to V active LOW); enables the transceiver to transmit data on the USB bus 4 O differential data receiver output (CMOS level with respect ...
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... Product data Type Description ISP1106/7 TSSOP16 15 - Internal regulator option: regulated supply voltage output (3.0 to 3.6 V) during 5 V operation; a decoupling capacitor of at least 0 ...
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... Product data Driving function using single-ended input data interface ( [for ISP1107 and ISP1105 (MODE = L Driving function using differential input data interface ( [for ISP1106 and ISP1105 (MODE = H)] VPO Receiving function ( ...
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Philips Semiconductors low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection of V reg(3.3) Table 8: Pins V CC(5.0) V ...
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Philips Semiconductors Table 10: Input option Internal regulator Regulator bypass 8. Limiting values Table 11: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC(5.0) V I/O supply voltage CC(I/O) V ...
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Philips Semiconductors 9. Static characteristics Table 13: Static characteristics: supply pins V = 4 3 reg(3.3) combinations unless otherwise specified. amb Symbol Parameter ...
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Philips Semiconductors Table 14: Static characteristics: digital pins V = 1. CC(I/O) GND Symbol Parameter V = 1.65 to 3.6 V CC(I/O) Input levels V LOW-level input voltage IL V HIGH-level input ...
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Philips Semiconductors Table 15: Static characteristics: analog I/O pins ( 4 3 reg(3.3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI ...
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Philips Semiconductors 10. Dynamic characteristics Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless ...
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Philips Semiconductors Table 16: Dynamic characteristics: analog I/O pins ( 4 3 reg(3.3) combinations unless otherwise specified. amb ...
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Philips Semiconductors 11. Test information for (1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Fig 9. Load for enable and disable times. Fig 10. Load for VM, VP ...
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Philips Semiconductors 12. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the ...
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Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 ...
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Philips Semiconductors 13. Packaging The ISP1105/1106/1107W (HBCC16 package) is delivered on a Type A carrier tape, see Figure The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...
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Philips Semiconductors 15. Additional soldering information 15.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The layer (0.1 m min.) ensures ...
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... Preliminary data; third version. Supersedes ISP1107- February 2001 (9397 750 07879). Modification: • ISP1107, ISP1106 and ISP1105 combined into one datasheet. 02 20010205 - Objective specification; second version. Supersedes ISP1107- February 2000 (9397 750 06899). ISP1107 stand-alone datasheet only. ...
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Philips Semiconductors 17. Data sheet status [1] [2] Data sheet status Product status Objective data Development Preliminary data Qualification Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product ...
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Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . ...