PIC16F616-I/SL Microchip Technology, PIC16F616-I/SL Datasheet - Page 160

IC PIC MCU FLASH 2KX14 14SOIC

PIC16F616-I/SL

Manufacturer Part Number
PIC16F616-I/SL
Description
IC PIC MCU FLASH 2KX14 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F616-I/SL

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
11
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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PIC16F610/616/16HV610/616
TABLE 15-10: SHUNT REGULATOR SPECIFICATIONS (PIC16HV610/616 only)
TABLE 15-11: PIC16F616/16HV616 A/D CONVERTER (ADC) CHARACTERISTICS:
DS41288C-page 158
Standard Operating Conditions (unless otherwise stated)
Operating temperature
AD01
AD02
AD03
AD04
AD07
AD06
AD06A
AD07
AD08
AD09* I
Note 1:
SHUNT REGULATOR CHARACTERISTICS
SR01
SR02
SR03*
SR04
SR05
Param
Param
No.
No.
2:
3:
4:
*
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
*
N
E
E
E
E
V
V
Z
REF
Sym
AIN
AIN
IL
DL
OFF
GN
REF
V
I
T
C
ΔI
R
Symbol
SHUNT
These parameters are characterized but not tested.
only and are not tested.
Total Absolute Error includes integral, differential, offset and gain errors.
The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
ADC V
When ADC is off, it will not consume any current other than leakage current. The power-down current
specification includes any such leakage from the ADC module.
These parameters are characterized but not tested.
SETTLE
SHUNT
LOAD
SNT
Resolution
Integral Error
Differential Error
Offset Error
Gain Error
Reference Voltage
Full-Scale Range
Recommended
Impedance of Analog
Voltage Source
V
REF
REF
Shunt Voltage
Shunt Current
Settling Time
Load Capacitance
Regulator operating current
Characteristic
Input Current
is from external V
-40°C ≤ T
Characteristics
(3)
(3)
A
≤ +125°C
REF
Min
V
2.2
2.5
10
or V
SS
DD
Preliminary
pin, whichever is selected as reference input.
Typ†
Standard Operating Conditions (unless otherwise stated)
Operating temperature
1.5
4.75
0.01
Min
4
10 bits
V
1000
Max
V
±1
±1
±1
10
50
REF
DD
Typ
5
Units
LSb V
LSb No missing codes to 10 bits
LSb V
LSb V
μA
μA
bit
V
V
Max
5.25
150
180
50
10
V
Absolute minimum to ensure 1 LSb
accuracy
During V
Based on differential of V
During A/D conversion cycle.
REF
REF
REF
REF
-40°C ≤ T
Units
= 5.12V
= 5.12V
= 5.12V
= 5.12V
mA
μA
μF
ns
V
© 2007 Microchip Technology Inc.
AIN
A
acquisition.
To 1% of final value
Bypass capacitor on V
pin
Includes band gap
reference current
≤ +125°C
Conditions
Comments
HOLD
to V
AIN
DD
.

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