PIC24HJ64GP206-I/PT Microchip Technology, PIC24HJ64GP206-I/PT Datasheet - Page 18

• Manufacturer Part Number: PIC24HJ64GP206-I/PT
• Description: IC PIC MCU FLASH 32KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP206-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 18 Channel
• Controller Family/series: PIC24
• No. Of I/o's: 53
• Ram Memory Size: 8KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Height: 1 mm
• Length: 10 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 10 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJXXXGPX06/X08/X10
APPENDIX A:
REVISION HISTORY
Revision A (6/2006)
Initial release of the document.
Revision B (12/2006)
Added issues 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16,
and 17.
Revision C (3/2007)
Changed document title, updated issue 8, and added
issues 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29,
30 and 31.
Revision D (6/2007)
Added the
following silicon
issues: 32 (SPI),
33 (UART), 34 (Device ID Register), 35 (DMA),
36 (Doze Mode and Traps) and 37 (DCI).
Revision E (10/2007)
Removed issue 6 (Output Compare) and issue 37
(DCI). Updated silicon issue 27 (Traps and Idle Mode).
Added silicon issues 36 (ECAN), 37 (Output Compare),
38-39 (UART), 40-42 (DMA), 43 (REPEAT Instruction),
and 44 (FRC Oscillator).
Revision F (4/2008)
Updated silicon issues 4 (DMA Module: Interaction with
EXCH Instruction) 10 (ECAN). Removed silicon issue
23 (ECAN). Added silicon issues 44 (UART), 45 (SPI)
2
and 46-47 (I
C).
Revision G (9/2008)
Added reference to silicon revision A4. Updated issue
2
8 (SPI in Slave Select Mode) and 24 (I
C). Removed
2
issue 35 (ECAN). Added silicon issues 47-49 (I
C), 50
(Internal Voltage Regulator), 51 (ECAN), 52 (PSV
Operations), 53 (UART (UxE Interrupt)) and 54 (UART
(IrDA)).
© 2008 Microchip Technology Inc.
DS80280G-page 18