DSPIC30F6014A-30I/PT Microchip Technology, DSPIC30F6014A-30I/PT Datasheet - Page 20

• Manufacturer Part Number: DSPIC30F6014A-30I/PT
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014A-30I/PT

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 80-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 68
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F6014A30IP

dsPIC30F6011A/6012A/6013A/6014A
2.3
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and 16/
16-bit signed and unsigned integer divide operations, in
the form of single instruction iterative divides. The
following instructions and data sizes are supported:
1.
2.
3.
4.
5.
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
TABLE 2-1:
DS70143C-page 18
DIVF
DIV.sd
DIV.ud
DIV.sw
DIV.uw
DIVF - 16/16 signed fractional divide
DIV.sd - 32/16 signed divide
DIV.ud - 32/16 unsigned divide
DIV.sw - 16/16 signed divide
DIV.uw - 16/16 unsigned divide
Instruction
Divide Support
DIVIDE INSTRUCTIONS
Signed fractional divide: Wm/Wn
Signed divide: (Wm + 1:Wm)/Wn
Unsigned divide: (Wm + 1:Wm)/Wn
Signed divide: Wm/Wn
Unsigned divide: Wm/Wn
W0; Rem
W0; Rem
Preliminary
W0; Rem
W0; Rem
W0; Rem
W1
W1
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g., a
series of discrete divide instructions) will not function
correctly because the instruction flow depends on
RCOUNT. The divide instruction does not automati-
cally set up the RCOUNT value and it must, therefore,
be explicitly and correctly specified in the REPEAT
instruction as shown in Table 2-1 (REPEAT will execute
the target instruction {operand value + 1} times). The
REPEAT loop count must be setup for 18 iterations of
the DIV/DIVF instruction. Thus, a complete divide
operation requires 19 cycles.
Function
Note:
W1
W1
W1
The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
© 2006 Microchip Technology Inc.