C8051F305-GM Silicon Laboratories Inc, C8051F305-GM Datasheet - Page 101

• Manufacturer Part Number: C8051F305-GM
• Description: IC 8051 MCU 2K FLASH 11QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F30xr

Specifications of C8051F305-GM

• Program Memory Type: FLASH
• Program Memory Size: 2KB (2K x 8)
• Package / Case: 11-VQFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SMBus/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 8
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F300DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• No. Of I/o's: 8
• Ram Memory Size: 256Byte
• Cpu Speed: 25MHz
• No. Of Timers: 3
• Rohs Compliant: Yes
• Package: 11QFN EP
• Device Core: 8051
• Family Name: C8051F30x
• Maximum Speed: 25 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1444 - ADAPTER PROGRAM TOOLSTICK F300
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1251

11.4. External Crystal Example
If a crystal or ceramic resonator is used as an external oscillator source for the MCU, the circuit should be
configured as shown in Figure 11.1, Option 1. The External Oscillator Frequency Control value (XFCN)
should be chosen from the Crystal column of the table in SFR Definition 11.3 (OSCXCN register). For
example, an 11.0592 MHz crystal requires an XFCN setting of 111b.
When the crystal oscillator is first enabled, the oscillator amplitude detection circuit requires a settling time
to achieve proper bias. Introducing a delay of 1 ms between enabling the oscillator and checking the
XTLVLD bit will prevent a premature switch to the external oscillator as the system clock. Switching to the
external oscillator before the crystal oscillator has stabilized can result in unpredictable behavior. The rec-
ommended procedure is:
Note: Tuning-fork crystals may require additional settling time before XTLVLD returns a valid
result.
The capacitors shown in the external crystal configuration provide the load capacitance required by the
crystal for correct oscillation. These capacitors are “in series” as seen by the crystal and “in parallel” with
the stray capacitance of the XTAL1 and XTAL2 pins.
Note: The load capacitance depends upon the crystal and the manufacturer. Please refer to the
crystal data sheet when completing these calculations.
For example, a tuning-fork crystal of 32.768 kHz with a recommended load capacitance of 12.5 pF should
use the configuration shown in Figure 12.1, Option 1. The total value of the capacitors and the stray capac-
itance of the XTAL pins should equal 25 pF. With a stray capacitance of 3 pF per pin, the 22 pF capacitors
yield an equivalent capacitance of 12.5 pF across the crystal, as shown in Figure 11.2.
Step 1. Force the XTAL1 and XTAL2 pins low by writing 0’s to the port latch.
Step 2. Configure XTAL1 and XTAL2 as analog inputs.
Step 3. Enable the external oscillator.
Step 4. Wait at least 1 ms.
Step 5. Poll for XTLVLD => ‘1’.
Step 6. Switch the system clock to the external oscillator.
Figure 11.2. 32.768 kHz External Crystal Example
32.768 kHz
22 pF
22 pF
Rev. 2.9
10 M

C8051F300/1/2/3/4/5
XTAL1
XTAL2
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