MCF52236CAF50 Freescale Semiconductor, MCF52236CAF50 Datasheet - Page 30

• Manufacturer Part Number: MCF52236CAF50
• Description: IC MCU 32BIT 256K FLASH 80-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5223xr

Specifications of MCF52236CAF50

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Processor Series: MCF522x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C, QSPI, UART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 56
• Number Of Timers: 10
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52235EVB, M52233DEMO
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical Characteristics
30
1
2
3
4
5
6
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package, natural convection
Maximum operating junction temperature
The use of this device in one- or two-layer board designs is not recommended due to the limited thermal conductance
provided by those boards.

recommends the use of 
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the 
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
JMA
and 
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Characteristic
JMA
MCF52235 ColdFire Microcontroller Data Sheet, Rev. 10
and power dissipation specifications in the system design to prevent device junction
Table 20. Thermal Characteristics
Symbol





JMA
T
JA
JB
JC
jt
j
80-pin LQFP, four-layer board
112-pin LQFP, four-layer board
121 MAPBGA, four-layer board
80-pin LQFP, one-layer board
121 MAPBGA, one-layer board
112-pin LQFP, one-layer board
80-pin LQFP, four-layer board
112-pin LQFP, four-layer board
121 MAPBGA, four-layer board
80-pin LQFP, one-layer board
112-pin LQFP, one-layer board
121 MAPBGA, one-layer board
80-pin LQFP
112-pin LQFP
121 MAPBGA, four-layer board
80-pin LQFP
112-pin LQFP
121 MAPBGA
80-pin LQFP
112-pin LQFP
121 MAPBGA
All
Package
1
1
1
1
1
1
1
jt
parameter, the device power
Freescale Semiconductor
36.0
Value
49.0
44.0
39.0
35.0
22.0
35.0
30.0
29.0
23.0
6.0
2.0
2.0
2.0
130
56
46
6.0
10
32
28
18
2,3
1
1
5
6
6
6
1
1
1
1
4
C / W
C / W
C / W
C / W
C / W
Unit
o
C