PIC24F16KA102-I/SS Microchip Technology, PIC24F16KA102-I/SS Datasheet - Page 16

• Manufacturer Part Number: PIC24F16KA102-I/SS
• Description: IC PIC MCU FLASH 16K 28-SSOP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24F16KA102-I/SS

• Program Memory Type: FLASH
• Program Memory Size: 16KB (5.5K x 24)
• Package / Case: 28-SSOP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 512 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24F
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 1.5 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MA240017 - MODULE PLUG-IN PIC24F16KA102 PIM
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24F16KA102 FAMILY
APPENDIX A:
Rev A Document (6/2009)
Initial release of this document; issued for revision A5.
Includes silicon issues 1 (CTMU), 2 (Resets – BOR),
3 (Core – ICSP), 4 (Core – Deep Sleep), 5 (Memory –
Code Protection), 6 (Comparator) and 7 (SPI –
Enhanced Buffer Mode). Includes data sheet clarifica-
tions 1 (Memory), 2 (Electrical Specifications – AC
Specifications), 3-6 (Electrical Specifications – DC
Specifications), 7 (A/D) and 8 (Comparators).
Rev B Document (6/2009)
Revision issued for silicon revision A6. Existing silicon
issues 1 (CTMU), 2 (Resets – BOR), 4 (Core – Deep
Sleep), 6 (Comparator) and 7 (SPI – Enhanced Buffer
Mode) added to revision A6. No new issues added.
Rev C Document (10/2009)
Revision issued for silicon revision A7. Existing silicon
issues 1 (CTMU), 2 (Resets – BOR), 4 (Core – Deep
Sleep), 6 (Comparator) and 7 (SPI – Enhanced Buffer
Mode) added to revision A7. Added new silicon issue 8
(I/O Ports – PORTA and PORTB).
To revision B of the data sheet, adds data sheet clarifi-
cations 9 (Pin Diagrams), 10 (A/D Converter –
AD1CHS Register), 11 (A/D Converter – AD1CHS
Register), 12 (Special Features – Configuration Bits),
13 (Power-Saving Features) and 14 (Electrical
Specifications – AC Specifications).
Rev D Document (10/2009)
Typographic correction: updated
rect associations between silicon issues and silicon
revisions.
Rev E Document (4/2010)
Added new silicon issue 9 (I/O Ports – PORTA and
PORTB) to all silicon revisions.
Updated existing silicon issue 8 to include additional
interactions and work arounds between RA0 and RB0.
Added
Specifications – DC Specifications) to revision B of the
data sheet.
Updated revision history to include entry for revision D.
DS80473F-page 16
data
sheet
DOCUMENT
REVISION HISTORY
clarification
Table 2
15
with the cor-
(Electrical
Rev F Document (11/2010)
Revision issued for silicon revision B0. Existing silicon
issues 2 (Resets – BOR) and 6 (Comparator) added to
revision B0.
Amended existing silicon issue 8 (I/O Ports – PORTA
and PORTB), to change “digital input” to analog input”
at the end of the fourth paragraph.
Added new silicon issue 10 (Core – Low Power BOR)
to silicon revisions A5, A6 and A7.
Added new silicon issues 11, 12 (Comparator) and
13 (Core – Doze Mode) to silicon revisions A5, A6 and
A7.
Removed data sheet clarification 16 (Electrical
Specifications – DC Specifications) to revision B of the
data sheet.
Removed data sheet clarification 6 (Electrical Specifi-
cations – DC Specifications) and combined it with data
sheet clarification 16 which is now data sheet
clarification 15.
 2010 Microchip Technology Inc.